LOCTITE 3611 is intended for applications where surface mount components are bonded to printed circuit boards prior to wave soldering. It is especially suitable for high-speed SMT production where fast curing is required online. The extremely low moisture absorption allows for prolonged exposure to the humid environment of an open container without affecting dispensing performance or causing cavities to form in the adhesive after curing
LOCTITE 3611 is intended for applications where surface mount components are bonded to printed circuit boards prior to wave soldering. It is especially suitable for high-speed SMT production where fast curing is required online. The extremely low moisture absorption allows for prolonged exposure to the humid environment of an open container without affecting dispensing performance or causing cavities to form in the adhesive after curing