LOCTITE uf3811 SEALANT
Room temperature flowability
Low viscosity material flows at room temperature without additional preheating
High glass transition temperature while maintaining flexibility to protect solder joints during thermal cycling and drop tests
Rapid curing at moderate temperatures to reduce stress on other components
产品描述
LOCTITE ECCOBOND UF 3811, halogen-free, reworkable, low viscosity, epoxy resin, underfill adhesive, sealant
LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is specifically designed for CSP and BGA applications. This low-viscosity material can flow at room temperature and does not require additional preheating. It cures rapidly at moderate temperatures, minimizing stress on other components. After curing, this material has a high glass transition temperature while maintaining flexibility to protect solder joints during thermal cycling and drop tests.
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