DOLPHON CB-1109 Flexible Polybutadiene Potting Resin for Electronic Encapsulation

DOLPHON CB-1109 Potting Resin for Flexible Electronic Encapsulation

DOLPHON CB-1109 Potting Resin is a two-component, black polybutadiene system developed for potting, casting, coating, and protecting electrical and electronic components that require a flexible encapsulant. The official Von Roll technical data sheet identifies this grade as DOLPHON CB-1109, rather than SYNTHITE CB-1109. DOLPHON and SYNTHITE are separate established insulation-material brands within the current ELANTAS portfolio.

When combined with RE 2018-4 Reactor, the resin forms a flexible cured material that can be considered as an alternative to selected silicone, polyurethane, and epoxy systems. It provides low-stress encapsulation around delicate components while maintaining excellent electrical insulation, moisture resistance, chemical resistance, and thermal-shock performance. Its repairable structure may also allow embedded components to be removed and replaced more easily than with very hard potting compounds.

Key Benefits of DOLPHON CB-1109 Potting Resin

DOLPHON CB-1109 Potting Resin offers high flexibility and low shrinkage, helping reduce mechanical stress on sensitive wires, solder joints, coils, ferrite cores, sensors, and electronic assemblies. The published shrinkage after curing and ageing for 48 hours at 120°C is approximately 0.02%. Its cured Shore A hardness is typically 35–45, while tensile strength is approximately 6.5 MPa and elongation at break reaches around 200%.

The system provides excellent resistance to thermal cycling. Official testing reports more than 30 thermal-shock cycles between approximately -40°C and 155°C. Its glass-transition temperature is below -50°C, and the cured material maintains flexibility down to approximately -40°C. These characteristics make it valuable for assemblies exposed to rapid temperature changes, outdoor operation, vibration, or differences in thermal expansion between electronic components and housings.

Electrical properties include a typical dielectric strength of 28 kV/mm, dielectric constant of 3.55 at 25°C and 50 Hz, and surface and volume resistivity above 10¹⁵. Thermal conductivity is approximately 0.40 W/m·K. Casting and potting materials protect electronic components against moisture, dust, chemicals, vibration, and thermal shock while supporting dielectric reliability.

Applications for DOLPHON CB-1109 Potting Resin

DOLPHON CB-1109 Potting Resin is suitable for encapsulating sensors, transformers, connectors, relays, amplifiers, coils, ferrite cores, motors, junction boxes, ground-fault interrupters, cable repairs, and complete electronic assemblies. It can also be used as a flexible stress-relief layer beneath or around harder encapsulation materials.

Its hydrolytic stability, very low moisture-vapour transmission, and resistance to degreasing solvents support applications exposed to humidity, cleaning chemicals, industrial contamination, and mechanical abrasion. Final suitability should be confirmed using the actual component materials, potting depth, operating voltage, thermal cycle, chemical exposure, and production process.

Processing DOLPHON CB-1109 Potting Resin

DOLPHON CB-1109 Potting Resin must be thoroughly stirred before use because fillers may settle during storage. Air should not be introduced while stirring. The resin and RE 2018-4 Reactor are mixed at a ratio of 100:15 by weight or volume. The resin viscosity is approximately 4,500–5,500 mPa·s, while the mixed system has a typical viscosity of 3,000–4,000 mPa·s at 25°C.

The mixed system provides a typical gel time of 70–90 minutes at 25°C for a 100 g mass. It cures at approximately 20°C, with a minimum curing period of around 24 hours. Higher temperatures up to about 60–65°C can accelerate curing. Preheating the components or resin to 40–60°C can improve flow into detailed assemblies, although it also shortens the available gel time.

For void-free encapsulation, vacuum processing can improve flow, penetration, dielectric performance, and mechanical consistency. All parts must be clean, dry, and free from oil, grease, dust, and moisture before potting.

Storage and Safety of DOLPHON CB-1109 Potting Resin

DOLPHON CB-1109 Potting Resin should be stored in its unopened original packaging and protected from moisture. The published storage life is 18 months for the resin at a maximum of 30°C and 12 months for RE 2018-4 Reactor at a maximum of 25°C. The system is intended for industrial use, and operators should review the current safety data sheets before mixing or dispensing.

For manufacturers requiring a flexible black encapsulant with low shrinkage, high elongation, strong electrical insulation, and excellent thermal-shock resistance, DOLPHON CB-1109 Potting Resin provides dependable protection for sensitive electrical and electronic assemblies. Explore our electronic potting compounds for sensors, transformers, coils, relays, motors, circuit boards, and industrial electronic devices.

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