EP138 is a one-component, heat-curing epoxy adhesive with a high-viscosity non-sag formulation. It provides strong adhesion, excellent durability, low curing shrinkage and good electrical insulation, making it suitable for electronics, automotive components, precision equipment and industrial assembly applications.
EP138 Epoxy Adhesive by CEMEDINE is a one-component heat-curing adhesive designed for industrial bonding and sealing.
Because EP138 is supplied as a one-component system, no weighing or mixing of resin and hardener is required. This helps reduce mixing errors and provides more consistent bonding performance in industrial production processes.
EP138 Epoxy Adhesive for Industrial Applications
One-component epoxy adhesive
Heat-curing system
High-viscosity, non-sag formulation
No mixing required
Solvent-free reactive adhesive
Low curing shrinkage
EP138 is suitable for:
Electronic component bonding
Electrical component sealing
Precision equipment assembly
Automotive component bonding
Machinery assembly
Metal component bonding
Composite material assembly
Model: EP138 Product Type: One-Part Heat-Curing Epoxy Adhesive Base Material: Epoxy Resin Appearance: Light Yellowish Brown Viscosity: Approx. 240 Pa·s at 23°C Density: Approx. 1.40 g/cm³
Electronics, Electrical Equipment, Automotive, Precision Equipment, Industrial Machinery, Transportation Equipment and General Manufacturing.
For more official technical information about EP138, please visit the official CEMEDINE website:
