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CEMEDINE EP008 Flexible Two-Part Epoxy Adhesive for Electronics and Industrial Assembly 320ml
46原价为：46。40当前价格为：40。
CEMEDINE EP008 is a two-part flexible epoxy adhesive designed for strong and durable industrial bonding. Its non-sag formulation, high peel resistance and good heat resistance make it suitable for electronics, electrical components, metal, plastics, precision equipment and mixed-material assembly applications.
CEMEDINE EP008 Flexible Epoxy Adhesive is a two-component, room-temperature curing epoxy adhesive designed for applications that require both high bonding strength and improved flexibility. Its non-sag formulation helps the adhesive remain in place on vertical, uneven and shaped bonding surfaces.
Compared with conventional rigid epoxy adhesives, EP008 provides better peel resistance and improved tolerance to vibration, impact and movement. It is suitable for bonding and sealing electrical and electronic components, construction composite materials, precision equipment and other industrial assemblies.
Key Features of CEMEDINE EP008 Flexible Epoxy Adhesive
Two-component epoxy adhesive
Flexible cured bond
Non-sag / high-viscosity formulation
1:1 mixing ratio
Approx. 60-minute working time at 23°C
Approx. 12-hour practical cure time at 23°C
High peel strength
Good heat resistance
Good heat-aging resistance
Excellent electrical insulation
Suitable for industrial bonding and sealing
Official CEMEDINE data lists typical tensile shear strength of about 23 MPa, T-peel strength of about 2.5 N/mm for current EP008A data, and Shore D hardness around 80.
Typical Applications
CEMEDINE EP008 is suitable for:
Electrical and electronic component bonding
Electronic component sealing
Metal component assembly
Plastic component bonding
Precision equipment assembly
Construction composite bonding
Industrial machinery assembly
Automotive and transportation components
Repair and maintenance applications
Product Information
Brand: CEMEDINE Model: EP008 / EP008A Product Type: Flexible Two-Part Epoxy Adhesive Base Resin: Epoxy Resin Hardener: Modified Polyamide Mixing Ratio: 1:1 Working Time: Approx. 60 Minutes at 23°C Effective Cure Time: Approx. 12 Hours at 23°C Standard Cure: 23°C × 7 Days Main Feature: Flexible / Non-Sag Type Package: 320ml Set
The older AP-002 320ml tube set is documented as a 440g set and has been discontinued in Japan, while current EP008A industrial packaging is mainly 500g cans.
Official Product Information
For more official technical information about CEMEDINE EP008A, visit the official CEMEDINE product page:
