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Weekend: 10AM - 5PM
Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM

Unlike conventional rigid epoxy systems, CEMEDINE EP008 Flexible Epoxy Adhesive provides a more flexible cured bond that can better accommodate vibration, impact, peel stress, and movement between dissimilar materials. This flexibility supports reliable performance in assemblies exposed to changing loads or different thermal expansion rates.
The system consists of an epoxy resin base and a modified polyamide hardener. Both components are mixed at a 1:1 ratio before application. At 23°C, the mixed product offers an approximate working life of 60 minutes, providing enough time for accurate placement, alignment, and assembly. Practical bonding strength develops in approximately 12 hours, while full standard curing is achieved after seven days at 23°C or through an accelerated cure of one hour at 80°C.

This industrial epoxy is designed for bonding and sealing electrical equipment and electronic components. It is also suitable for assembling precision instruments, craft products, construction composite members, vehicle-related parts, and other components requiring dependable adhesion. Its broad substrate compatibility makes it useful for joining metals, selected plastics, fiber-reinforced materials, ceramics, and mixed-material assemblies.
The non-sag consistency is especially valuable when the adhesive must remain on vertical joints, edges, gaps, or shaped parts before assembly. Manufacturers can use it for controlled bonding in equipment production, maintenance departments, engineering workshops, and OEM assembly lines.
Clean both bonding surfaces thoroughly and remove oil, grease, dust, moisture, oxidation, and release agents. Measure equal quantities of the base resin and hardener, then mix completely until the appearance is uniform. Apply the mixed adhesive within the recommended working time and assemble the parts before the material begins to thicken.
Maintain proper alignment and fixture pressure during initial curing. Bond-line thickness, ambient temperature, substrate condition, adhesive quantity, and joint design can affect curing speed and final performance. Users should test representative materials before production and review the latest technical data sheet and safety data sheet before handling.
For high-volume manufacturing, controlled metering and mixing equipment can improve ratio accuracy and reduce waste. Avoid returning mixed material to the original containers, and keep dispensing tools clean to prevent contamination. Store unopened components according to the manufacturer’s instructions.
CEMEDINE EP008 Flexible Epoxy Adhesive is a practical choice for factories, repair teams, distributors, and engineering companies seeking a strong yet flexible two-part bonding solution. Confirm the required package size, current availability, shelf life, and export documentation before purchasing. Technical support is available for application process selection.
Review the official CEMEDINE two-component epoxy adhesive information, or explore our two-component epoxy adhesives for related industrial bonding products.