CEMEDINE 1500 Two-Part Epoxy Adhesive for Metal, Plastic, Electronics and Precision Assembly

CEMEDINE 1500 Epoxy Adhesive Benefits

CEMEDINE 1500 Epoxy Adhesive is a solvent-free reactive bonding system. Because it does not rely on solvent evaporation, the adhesive produces minimal dimensional change during curing and does not generate gas through a drying process. This helps create a stable bond line in precision components, sealed electronic assemblies and composite structures.

The resin and hardener are mixed at a convenient 1:1 ratio, simplifying manual preparation and helping operators maintain a consistent formulation. Its pot life of up to approximately one hour at 23°C provides sufficient time to spread the mixed adhesive, position components and make assembly adjustments. Practical strength develops in approximately six hours, while the standard full-curing condition is 24 hours at 23°C.

Once cured, the epoxy delivers high adhesive strength, excellent durability and low creep under continuous load. Its rigid bond distributes mechanical stress across the joined area and can reduce reliance on screws, rivets or welding in properly engineered assemblies.

Applications for CEMEDINE 1500 Epoxy Adhesive

CEMEDINE 1500 Epoxy Adhesive can be used for bonding and sealing electrical equipment, electronic parts, precision instruments and industrial components. Typical applications include metal housings, sensors, control devices, appliance parts, machinery components, brackets, panels, decorative assemblies and composite construction materials.

The adhesive is suitable for many compatible substrates, including steel, aluminum, copper, hard PVC, polystyrene, acrylic, FRP, melamine decorative board and plywood. Published testing shows particularly strong adhesion to steel and fiber-reinforced plastic. Because plastics, coatings, surface treatments and production conditions vary, the actual materials should always be tested before commercial use.

Its electrical insulation performance also supports potting, sealing and assembly applications around suitable electrical or electronic components. Additional uses include vehicle components, marine assemblies, sporting equipment, construction composite members, handicrafts and artwork requiring a strong room-temperature-cured bond.

CEMEDINE 1500 Epoxy Adhesive Technical Properties

The base resin is a light-yellow transparent epoxy material, while the polyamide hardener is light-brown and transparent. At 23°C, the resin has a published viscosity of approximately 20 Pa·s and a density of 1.16 g/cm³. The hardener has a viscosity of approximately 55 Pa·s and a density of 0.97 g/cm³.

After curing under the stated conditions, typical tensile-shear adhesive strength is approximately 15.7 MPa. Representative cured properties include Shore D hardness of about 82, a glass-transition temperature near 54°C, water absorption of approximately 0.8% and volume resistivity of about 7.1 × 10¹⁵ Ω·cm. These figures are typical technical values rather than guaranteed purchasing specifications.

How to Apply CEMEDINE 1500 Epoxy Adhesive

Clean all bonding surfaces and remove oil, grease, moisture, dust, rust, oxidation and loose contamination. Abrading smooth metal or plastic surfaces may improve mechanical adhesion, provided the substrate can tolerate the treatment. After abrasion, remove all remaining dust before applying the adhesive.

Dispense equal quantities of resin and hardener and mix them thoroughly until the color and consistency are uniform. Apply the mixture to one or both surfaces, assemble the components within the available working time and hold them securely with clamps or fixtures. Avoid loading the joint until sufficient practical strength has developed.

Mix only the amount that can be applied within approximately one hour. Larger mixed quantities may react faster and generate more heat. Remove excess uncured adhesive before it hardens and follow the current Safety Data Sheet for handling, personal protection and disposal.

Why Choose CEMEDINE 1500 Epoxy Adhesive?

CEMEDINE 1500 Epoxy Adhesive combines high structural strength, a long working time, low curing shrinkage, chemical resistance and excellent electrical insulation. It is a practical Japanese epoxy system for industrial assembly, electronic sealing, precision equipment, composite construction and multi-material bonding.

Review the official CEMEDINE 1500 product information before qualification or production use. Explore our two-part epoxy adhesives for additional structural bonding, repair, potting and assembly solutions.