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304 North Cardinal
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Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM
Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM

KONISHI SL220W Elastic Adhesive arrives ready for direct application, eliminating weighing, mixing, and proportioning. This one-part format helps reduce operator error, preparation time, and material waste in production dispensing. The product develops useful initial adhesion and maintains its applied shape, allowing components to remain positioned while curing progresses.
The formulation contains no tin compounds and is designed without low-molecular-weight cyclic polysiloxanes that may contribute to electrical contact problems. It is also presented as RoHS compliant, making it suitable for electronics manufacturing. Because the cured bond remains elastic, it can protect components from repeated shock, vibration, and thermal cycling.
This adhesive is recommended for polycarbonate, ABS, metals, and other rigid industrial materials after testing. Typical uses include fixing display frames, bonding electronic housings, reinforcing connectors, securing sensors, stabilizing motor parts, attaching brackets, and sealing gaps around components. It is especially useful when dissimilar hard materials have different coefficients of thermal expansion or when the assembly may experience vibration during service.
The white appearance provides a clean finish and supports visual inspection. Its non-sag consistency is valuable for electronic modules, appliances, automotive electronics, displays, and industrial devices where run-off must be controlled. The product can also be used as a filling adhesive, although deeper sections require additional time because curing progresses through atmospheric moisture.
Published guide values identify a viscosity range of approximately 90 to 200 Pa·s at 23°C, specific gravity from 1.20 to 1.30, and skin formation in about 6 to 15 minutes at 23°C and 50% relative humidity. Typical tensile lap-shear strength is listed at approximately 4.35 N/mm² on stainless steel, 3.92 N/mm² on ABS, and 2.13 N/mm² on polycarbonate under stated test conditions.
Additional representative properties include Type A durometer hardness near 50, maximum tensile stress around 5.3 N/mm², and elongation at break of approximately 275%. Electrical guide values include volume resistivity of 1.8 × 10¹² Ω·cm, thermal conductivity of 0.22 W/m·K, dielectric constant of 4.89 at 1 MHz, and dissipation factor of 0.049. These figures are typical rather than guaranteed specifications.
Clean each bonding surface and remove oil, moisture, dust, oxidation, flux residue, and mold-release agents. Apply a controlled bead or dot to one substrate, assemble the parts promptly, and fixture them when movement is possible. Ensure that atmospheric moisture can reach the adhesive during curing, especially in deep or enclosed joints.
Validate nozzle size, dispensing pressure, bead dimensions, bond-line thickness, fixture time, and full-cure performance on actual components. Close the package immediately after use and follow the current Safety Data Sheet for safe handling and storage. The product is commonly supplied in 120 ml tubes and 333 ml cartridges.
KONISHI SL220W Elastic Adhesive combines fast room-temperature curing, high-viscosity placement, broad adhesion, electrical insulation, and flexible stress absorption in one convenient product. It is a practical Japanese adhesive for manufacturers requiring dependable bonding and sealing of rigid plastics, metals, displays, sensors, and vibration-sensitive electronic components.
Review the official KONISHI SL and FB Series catalog before qualification. Explore our electronic component adhesives for additional elastic bonding, sealing, fixing, and assembly solutions.