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Weekend: 10AM - 5PM
Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM

LOCTITE ECCOBOND F113SC Epoxy Adhesive is a two-component epoxy system developed for precision fiber optic connector termination and optoelectronic assembly. Designed for applications where low viscosity, strong bonding, controlled stress, and clean finishing are important, it combines practical processing with dependable cured performance. The resin is clear, the hardener is dark blue, and the mixed adhesive becomes dark blue, giving operators excellent visual contrast during connector polishing and inspection.
For manufacturers working with fiber optic connectors, lenses, LED displays, and optoelectronic devices, this adhesive offers a useful balance of flow, strength, and thermal capability. Its mixed viscosity is approximately 1,800 mPa·s at 25°C, helping the material wet narrow bonding areas and support accurate dispensing. The formulation is designed to create low-stress connections with no pistoning, an important advantage in fiber-to-ferrule bonding where dimensional stability and alignment are critical.
LOCTITE ECCOBOND F113SC Epoxy Adhesive uses a resin-to-hardener mix ratio of 100:30 by weight. After mixing, the material has a typical pot life of about 35 minutes for a 25 g mass and a work life of approximately one hour, giving operators practical time for assembly and positioning. The dark blue mixed color makes excess adhesive easier to identify during finishing, while the high bond strength supports secure component retention.
The cured material has a typical glass transition temperature of 95°C and Shore D hardness of 83. Its operating temperature range is approximately -60°C to 120°C, making it suitable for assemblies exposed to temperature variation. Typical lap shear strength values are reported at 3,900 psi after one hour at 65°C and 2,700 psi after 24 hours at 25°C.
LOCTITE ECCOBOND F113SC Epoxy Adhesive can be cured at room temperature or with heat, allowing production teams to match the process to throughput requirements. Typical cure schedules include 18 hours at 25°C, one hour at 65°C, or 15 minutes at 90°C for one-drop applications. For connector polishing, sufficient cure can develop after approximately 15 minutes at 65°C. Actual cure conditions should be validated for the specific assembly, adhesive quantity, oven loading, and production environment.
This product is especially suited to terminating fiber optic connectors and can also be considered for LED displays, lenses, and other optoelectronic device assembly. Its low viscosity supports penetration into tight interfaces, while the high-Tg epoxy structure helps maintain mechanical integrity after cure. The combination of controlled flow, dark blue visibility, and strong adhesion makes it a practical choice for precision optical manufacturing, telecom components, data communication hardware, and specialized electronic assemblies.
Before applying LOCTITE ECCOBOND F113SC Epoxy Adhesive, clean all bonding surfaces to remove contaminants that could reduce adhesion. Thoroughly mix the two components until the color is uniform. Apply the mixed epoxy to the prepared surfaces, assemble the components, and maintain contact until adequate cure is achieved. Because components may separate during storage or shipping, bulk material should be mixed thoroughly before combining resin and hardener.
When your application requires a low-viscosity, high-strength two-part epoxy for fiber optic and optoelectronic assembly, LOCTITE ECCOBOND F113SC Epoxy Adhesive offers a proven combination of process flexibility and precision bonding performance. It is suited to production environments where connector stability, polishing visibility, thermal performance, and consistent assembly quality matter. Contact us for packaging options, availability, lead time, technical documentation, and purchasing support.

For official technical information, visit Henkel Adhesive Technologies. Explore our industrial epoxy adhesives for additional bonding solutions.