Working hours:Mon - Sat 8.00 - 18.00 Call Us: (+ 86) 13926990959
LOCTITE 84-1 EPOXY RESIN
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
产品描述
Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
BALTIMORE
CONTACT US
Interactively coordinate proactive “outside the box“ thinking.
LOCATIONS
We Are Everywhere
Hi, We are here.
Submit your wishes, we will take the initiative to contact you.