KONISHI fb500zw SEALANT
Product features: It does not use low-molecular cyclic polysiloxane that may cause contact disorders. Due to its elasticity, it causes less deformation on the bonding material and can resist thermal shock.
Application scope: It can be used for the bonding of various materials. Bonding of various hard plastic materials such as polycarbonate ABS resin and bonding of metal materials; Bonding of hard materials with different thermal expansion coefficients.
产品描述
Product features: It does not use low-molecular cyclic polysiloxane that may cause contact disorders. Due to its elasticity, it causes less deformation on the bonding material and can resist thermal shock.
Application scope: It can be used for the bonding of various materials. Bonding of various hard plastic materials such as polycarbonate ABS resin and bonding of metal materials; Bonding of hard materials with different thermal expansion coefficients.
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