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LOCTITE 3128 low-temperature epoxy adhesive
Product features
Low-temperature curing at 80°C for 20 minutes ensures good bonding strength.
2. Precise dispensing, capable of meeting the dispensing requirements of 23# and 25# dispensing needles;
3. Low CTE, more precise bonding;
4. There is no glue overflow or displacement during curing.
产品描述
Loctite 3128 is a one-component black epoxy adhesive that cures by low-temperature heating. This product can demonstrate excellent adhesion to most substrates in a relatively short period of time. Typical applications include memory cards and CCD/CMOS assemblies. It is especially suitable for bonding heat-sensitive components that require low-temperature curing.
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