LOCTITE EA E-60NC Epoxy Potting Compound is a two-part, flowable encapsulation material developed to protect sensitive electrical and electronic components. The black epoxy cures at room temperature to form a rigid, opaque barrier with dependable electrical insulation, environmental resistance, and chemical resistance. Its extended working life gives production teams processing flexibility when filling housings, potting circuit assemblies, attaching components to printed circuit boards, or completing precision applications that require accurate placement before curing begins.

LOCTITE EA E-60NC Epoxy Potting Compound for electronic component encapsulation

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Key Benefits of LOCTITE EA E-60NC Epoxy Potting Compound

This industrial-grade epoxy system is designed for electronics where corrosion control and long-term protection are important. Once fully cured, it is non-corrosive to metallic components on printed circuit boards and electronic assemblies. The low-viscosity, flowable consistency helps the mixed compound move around components and into cavities, supporting uniform coverage when used with a controlled dispensing process.

LOCTITE EA E-60NC Epoxy Potting Compound creates a hard encapsulant that can help protect components from moisture, dirt, handling damage, chemicals, and challenging environmental exposure. Its insulating performance makes it suitable for industrial controls, sensors, electronic housings, power supplies, PCB assemblies, and other equipment requiring durable protection. The black appearance also supports visual inspection during production.

Electronic Applications for LOCTITE EA E-60NC Epoxy Potting Compound

Typical applications include potting corrosion-sensitive electrical components, attaching components to boards, filling electronic housings, encapsulating assemblies, and bonding selected industrial materials. Published test data covers substrates including aluminum, steel, stainless steel, polycarbonate, nylon, PVC, ABS, epoxy, acrylic, glass, and wood. Compatibility should always be confirmed on the actual production substrate.

Because the cured epoxy is rigid, engineers should evaluate thermal expansion, component stress, cavity depth, and service conditions during qualification. Controlled dispensing and suitable venting can help minimize trapped air. Manufacturers should also verify compatibility with coatings, wire insulation, connectors, and other construction materials.

Mixing LOCTITE EA E-60NC Epoxy Potting Compound

The resin and hardener are mixed at a 1:1 ratio by volume or 100:86 by weight. For dual cartridges, install the cartridge in a compatible application gun, confirm that both sides flow evenly, and attach the correct static mixing nozzle. Discard the first small quantity to help ensure a uniform mixture. For hand or bulk mixing, combine the components thoroughly and continue mixing for approximately 15 seconds after a consistent color is achieved.

Application and Curing Instructions

Apply the mixed material within approximately 60 minutes. Larger quantities and higher temperatures can shorten the available working time. For structural bonding, spread the adhesive evenly over both prepared surfaces and prevent movement during curing. Henkel recommends a bond line of approximately 1 to 2 mm for maximum shear strength. At 25°C, allow about 24 hours to develop high strength. Heating up to 93°C can accelerate curing when the process allows.

Surface Preparation and Storage

Surfaces should be clean, dry, and free from grease, oil, paint, oxide films, dust, mold-release agents, and loose contamination. Correct preparation supports stronger adhesion and consistent encapsulation. Excess uncured material may be cleaned with a compatible ketone-type solvent while following workplace safety instructions.

After seven days of curing at 23°C, the product has a typical tensile strength of 35 N/mm², Shore D hardness of 80, and dielectric breakdown strength of 20 kV/mm. These values are reference data rather than guaranteed purchase specifications. Store unopened containers in a dry area, ideally between 8°C and 21°C.

Why Buy LOCTITE EA E-60NC Epoxy Potting Compound?

LOCTITE EA E-60NC Epoxy Potting Compound combines flowable processing, extended work life, room-temperature curing, corrosion-free protection, electrical insulation, and environmental resistance. It is a strong choice for manufacturers seeking a professional epoxy system for PCB component attachment, housing assembly, and electronic potting. Review the official Henkel technical data sheet before storage, qualification, or production use.

electronic potting compounds