Momentive SNAPSIL TN3005C Silicone Adhesive Sealant is a one-component, non-flowing silicone developed for bonding, fixing, insulating, and waterproof sealing in electronic and electrical assemblies. The low-volatility formulation cures at room temperature after exposure to atmospheric moisture, creating a flexible silicone rubber without mixing or heat. Its rapid tack-free performance, low-odor alcohol cure, reduced ionic impurities, and primerless adhesion to many common substrates make it suitable for OEM manufacturers, electronics assemblers, maintenance teams, and precision production lines.

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Momentive SNAPSIL TN3005C Silicone Adhesive Sealant Performance

This electronics-grade adhesive sealant reaches a typical tack-free time of approximately seven minutes at 23°C and 50% relative humidity. After three days of curing under standard conditions, the material forms an elastic rubber with a typical density of 1.04 g/cm³, Shore A hardness of 22, tensile strength of 1.8 MPa, elongation of 330%, and adhesion strength of approximately 1.2 MPa. These balanced properties allow the cured silicone to hold components securely while absorbing vibration, thermal movement, and mechanical stress.

Momentive SNAPSIL TN3005C Silicone Adhesive Sealant also provides strong electrical insulation. Published typical values include volume resistivity of 2.0 × 10¹⁵ Ω·cm, dielectric strength of 26 kV/mm, dielectric constant of 2.7 at 60 Hz, and dissipation factor of 0.002. The formulation contains approximately 0.01% volatile siloxanes from D3 to D10, supporting applications where reduced low-molecular-weight siloxane content is important.

Electronic Bonding and Waterproof Sealing Applications

Typical uses include fixing electronic components, reinforcing connectors and terminals, sealing communication equipment, insulating electrical parts, and protecting assemblies against moisture, dust, and environmental contamination. The non-flowing paste remains where it is dispensed, making it practical for vertical surfaces, localized reinforcement, wire fixing, sensor sealing, PCB component support, and electronic enclosure joints.

The product shows good adhesion to aluminum, copper, steel, stainless steel, glass, epoxy resin, phenolic resin, PET, ABS, PBT, PPS, PVC, nylon, polycarbonate, PPO, and acrylic resin. Untreated polyethylene and PTFE are not recommended substrates. Because substrate grades, coatings, cleaning methods, joint designs, and curing conditions vary, manufacturers should test representative production parts before final process approval.

7 Benefits of Momentive SNAPSIL TN3005C Silicone Adhesive Sealant

One-component moisture cure with no measuring or mixing required.
Fast seven-minute tack-free performance under typical conditions.
Low-volatility silicone for sensitive electronic assemblies.
Non-corrosive performance on most metals, including copper materials.
Primerless adhesion to many metals, plastics, resins, and glass.
Flexible electrical insulation and vibration-resistant component protection.
Low-odor alcohol cure with UL 94 HB recognized flame retardancy.

Application and Processing Guidance

Clean the target surfaces thoroughly and remove oil, grease, dust, moisture, flux residue, oxidation, and release agents. Dispense the required bead onto one surface, assemble or position the components, and allow adequate exposure to atmospheric moisture. Cure begins from exposed areas and progresses inward, so thick sections and enclosed joints require more time than thin, openly exposed beads.

Silicone materials typically operate from approximately -45°C to 200°C, although long-term performance depends on design stress, substrates, thermal cycling, chemical exposure, and actual service conditions. Review the latest safety data sheet and product label before handling. Store unopened material away from direct sunlight in a dry indoor location and keep the original package tightly sealed.

Official Resources and Related Electronic Products

Review the official Momentive SNAPSIL TN3005 product page and the official Momentive TN3005 technical data sheet for current technical properties, handling information, and application guidance.

Explore our electronic silicone adhesives for related component bonding, sealing, and strain-relief products. You can also browse our electronic potting compounds for deeper encapsulation, electrical insulation, and environmental protection. Contact our sales team for quotations, package availability, export documentation, bulk purchasing, and product application support.