CEMEDINE EP330 Epoxy 320ml is a professional two-component room-temperature curing epoxy adhesive designed for industrial bonding applications requiring strong adhesion, reliable durability and sufficient working time. The AP-080 package contains two 160ml tubes, providing a total 320ml set for metal, ceramic, electronic and precision equipment assembly.

Table of Contents

Product Overview

CEMEDINE EP330 AP-080 is a 30-minute type two-part epoxy adhesive developed for professional and industrial applications. It is the industrial version of CEMEDINE’s High Super 30 type and provides a practical balance between working time, bonding strength and ease of application.

The system consists of an epoxy resin base and a curing agent. The two components are mixed at a 1:1 ratio before use. The base resin is pink translucent, while the hardener is light yellow translucent. After proper mixing and curing, the adhesive develops a light transparent appearance.

CEMEDINE EP330 Epoxy 320ml provides approximately 30 minutes of usable working time at 23°C, giving operators enough time to position components accurately before the material begins to cure.

Key Features and Advantages

30-Minute Working Time

Unlike very fast five-minute epoxy systems, EP330 provides a longer working period for positioning, adjustment and assembly.

The approximately 30-minute pot life is especially useful for larger parts, complicated assemblies and applications where accurate alignment is required before the adhesive develops strength.

Strong and Durable Bonding

The cured epoxy provides excellent adhesion and long-term durability for industrial assemblies.

Typical tensile shear strength is approximately 17.5 MPa under CEMEDINE test conditions, making the product suitable for a wide range of rigid bonding applications.

Low Curing Shrinkage

The solvent-free reactive epoxy system produces relatively low shrinkage during curing. This characteristic helps maintain dimensional stability and reduces stress around bonded components.

Excellent Electrical Insulation

CEMEDINE EP330 Epoxy 320ml offers good electrical insulation properties, making it suitable for selected electrical and electronic component bonding and sealing applications.

Simple 1:1 Mixing Ratio

The base resin and hardener are mixed in equal proportions. This straightforward mixing ratio simplifies preparation and helps reduce operator errors during industrial use.

Applications

Electronic and Electrical Components

EP330 is suitable for bonding and sealing selected electrical and electronic components where strong adhesion and insulation properties are required.

Precision Equipment Assembly

The 30-minute working time provides sufficient time for accurate positioning of precision components and mechanical assemblies.

Metal Bonding

The adhesive can be used for bonding steel, stainless steel, aluminum, copper and other suitable metal materials.

CEMEDINE publishes typical tensile shear values for EP330 on several metal substrates, demonstrating its broad industrial bonding capability.

Ceramic and Rigid Material Bonding

The product is also suitable for ceramics, glass and selected rigid materials used in machinery, industrial equipment and repair applications.

Construction Composite Materials

EP330 can be used for bonding selected composite components used in construction and industrial fabrication.

Suitable Applications

Typical applications include:

Metal component bonding
Ceramic bonding
Electronic component assembly
Electrical equipment sealing
Precision equipment assembly
Industrial component repair
Composite material bonding
Machinery assembly

Technical Information

Brand: CEMEDINE

Model: EP330

Product Code: AP-080

JAN Code: 4901761103657

Product Type: Two-Part Epoxy Adhesive

Capacity: 320ml Set

Package Configuration:
Base Resin 160ml + Hardener 160ml

Base Resin: Epoxy Resin

Hardener: Polythiol-Based Curing Agent

Base Appearance: Pink Translucent

Hardener Appearance: Light Yellow Translucent

Mixing Ratio: 1:1

Base Viscosity: Approx. 70 Pa·s at 23°C

Hardener Viscosity: Approx. 160 Pa·s at 23°C

Base Density: Approx. 1.17 g/cm³

Hardener Density: Approx. 1.14 g/cm³

Pot Life: Within Approx. 30 Minutes at 23°C

Practical Strength: Approx. 1 Hour at 23°C

Standard Cure: 23°C × 24 Hours

Tensile Shear Strength: Approx. 17.5 MPa

T-Peel Strength: Approx. 0.47 N/mm

Hardness: Shore D 82

Glass Transition Temperature: Approx. 43°C

Water Absorption: Approx. 2.3%

Compliance: JAIA F☆☆☆☆ / JAIA 4VOC

Why Choose CEMEDINE EP330 Epoxy 320ml

CEMEDINE EP330 Epoxy 320ml combines strong adhesion, convenient 1:1 mixing and a practical 30-minute working time for professional industrial bonding.

Compared with very fast epoxy systems, EP330 provides more time for accurate positioning and adjustment while still reaching practical strength in approximately one hour.

Its solvent-free formulation, low curing shrinkage, electrical insulation and broad material compatibility make it suitable for electronics, precision equipment, metal components and general industrial assembly.