CEMEDINE EP331 Low Viscosity Epoxy 2kg is a two-component room-temperature curing epoxy adhesive system consisting of AP-084 base resin 1kg and AP-085 hardener 1kg. Developed for industrial applications requiring low viscosity, strong adhesion and approximately 30 minutes of working time, EP331 is suitable for electronics, precision equipment, composite materials and professional assembly.

Table of Contents

Product Overview

CEMEDINE EP331 is a low-viscosity version of CEMEDINE’s fast-curing two-part epoxy adhesive family. The system contains an epoxy resin base and a polythiol curing agent that must be mixed together before use.

The AP-084 base resin and AP-085 hardener are each supplied in a 1kg can. The recommended mixing ratio is 1:1, providing a total usable adhesive quantity of approximately 2kg when both components are purchased as a set.

CEMEDINE EP331 Low Viscosity Epoxy 2kg provides approximately 30 minutes of usable working time at 23°C. This gives operators enough time for dispensing, positioning and assembly while still allowing relatively rapid strength development.

The low-viscosity formulation also provides good flow into narrow gaps, complicated assemblies and bonding areas where higher-viscosity epoxy systems may be more difficult to apply.

Key Features and Advantages

Low-Viscosity Formulation

EP331 is specifically designed as a low-viscosity two-part epoxy system.

According to CEMEDINE’s current technical data, the base resin has a viscosity of approximately 4 Pa·s at 23°C, while the hardener is approximately 5 Pa·s.

This low viscosity improves wetting and flow around components and allows the adhesive to enter small clearances more easily.

30-Minute Working Time

CEMEDINE EP331 Low Viscosity Epoxy 2kg provides a pot life of approximately 30 minutes at 23°C.

This working time provides a practical balance between production efficiency and sufficient positioning time for complex assemblies.

Simple 1:1 Mixing Ratio

The AP-084 base resin and AP-085 hardener are mixed at an equal 1:1 ratio.

The simple mixing ratio helps reduce weighing errors and improves repeatability during industrial production.

Strong Adhesion and Durability

After proper curing, the EP331 system provides high adhesion and reliable long-term durability.

Typical tensile shear strength is approximately 17.6 MPa under CEMEDINE test conditions.

Low Curing Shrinkage

The reactive solvent-free epoxy system provides relatively low curing shrinkage, helping maintain dimensional stability in precision assemblies.

Electrical Insulation

The cured adhesive offers excellent electrical insulation characteristics, making it suitable for selected electrical and electronic component bonding and sealing applications.

Applications

Electrical and Electronic Components

CEMEDINE EP331 Low Viscosity Epoxy 2kg is suitable for bonding and sealing electrical and electronic components requiring strong adhesion and insulation.

Precision Equipment

The combination of low viscosity and 30-minute working time is useful for precision assemblies where accurate component positioning and good adhesive flow are required.

Metal Bonding

EP331 can be used for bonding suitable metals and industrial components where a strong rigid epoxy joint is required.

Composite Material Bonding

The adhesive is suitable for selected construction and industrial composite members.

Gap Filling and Flow Applications

Because of its low viscosity, EP331 is especially suitable for narrow gaps, small clearances and areas where adhesive penetration is important.

Mixing and Curing Information

Base Resin:
CEMEDINE EP331 AP-084 – 1kg

Hardener:
CEMEDINE EP331 AP-085 – 1kg

Mixing Ratio:
Base Resin : Hardener = 1 : 1

Pot Life:
Within approximately 30 minutes at 23°C

Time to Practical Strength:
Approximately 1 hour at 23°C

Standard Cure:
23°C × 24 Hours

Both components must be thoroughly mixed before application. Neither AP-084 nor AP-085 should be used alone.

Technical Information

Brand: CEMEDINE

Model: EP331

Base Resin Code: AP-084

Hardener Code: AP-085

Total Capacity: 2kg Set

Base Resin Capacity: 1kg

Hardener Capacity: 1kg

Product Type: Two-Part Low-Viscosity Epoxy Adhesive

Base Resin Main Component: Epoxy Resin

Hardener Main Component: Polythiol

Base Resin Appearance: Light Yellow Transparent

Hardener Appearance: Light Yellow Transparent

Base Resin Viscosity: Approx. 4 Pa·s at 23°C

Hardener Viscosity: Approx. 5 Pa·s at 23°C

Base Resin Density: Approx. 1.19 g/cm³

Hardener Density: Approx. 1.20 g/cm³

Mixing Ratio: 1:1

Pot Life: Within Approx. 30 Minutes

Practical Strength: Approx. 1 Hour

Standard Cure: 23°C × 24 Hours

Tensile Shear Strength: Approx. 17.6 MPa

T-Peel Strength: Approx. 0.24 N/mm

Hardness: Shore D 82

Glass Transition Temperature: Approx. 41°C

Water Absorption: Approx. 0.8%

Volume Resistivity: Approx. 1.1 × 10¹⁶ Ω·cm

Why Choose CEMEDINE EP331

CEMEDINE EP331 combines low viscosity, convenient 1:1 mixing and rapid room-temperature curing in a professional industrial epoxy system.

The 1kg base resin plus 1kg hardener package is especially suitable for manufacturers requiring larger working quantities for electronics, precision equipment and industrial assembly.

Its strong adhesion, low curing shrinkage, excellent insulation and good flow characteristics make EP331 a practical solution for demanding production and maintenance applications.