CEMEDINE EP007 Flexible Epoxy 1kg is a two-component room-temperature curing epoxy adhesive system developed for applications requiring strong adhesion together with improved flexibility and peel resistance. The complete 1kg system consists of AP-180 base resin 500g and AP-181 hardener 500g, mixed at a 1:1 ratio before application.

Table of Contents

Product Overview

CEMEDINE EP007 is a flexible two-part epoxy adhesive designed to provide higher peel resistance than conventional rigid epoxy systems.

The AP-180 base resin is a light yellow transparent epoxy resin, while AP-181 is a light brown transparent modified polyamide hardener. Both components are supplied in separate 500g cans.

When the two components are thoroughly mixed at a 1:1 weight ratio, the adhesive cures at room temperature and forms a strong, durable and relatively flexible bond.

CEMEDINE EP007 Flexible Epoxy 1kg provides approximately 60 minutes of usable working time at 23°C, making it suitable for larger or more complicated assemblies where accurate positioning is required before curing.

Key Features and Advantages

Flexible Epoxy Bonding

EP007 is classified by CEMEDINE as a flexible epoxy adhesive.

Compared with standard rigid epoxy systems, the cured adhesive offers improved ability to accommodate vibration, movement and differences in thermal expansion between bonded materials.

High Peel Strength

CEMEDINE EP007 Flexible Epoxy 1kg provides excellent peel resistance.

Its typical T-peel strength is approximately 2.20 N/mm, making it useful for assemblies where peeling or bending forces may occur during service.

Strong Tensile Shear Adhesion

The complete EP007 system provides typical tensile shear strength of approximately 22.0 MPa under CEMEDINE test conditions.

This makes it suitable for demanding industrial bonding of metals, engineering components and selected plastics.

Good Heat Resistance

EP007 offers good heat resistance and heat-aging resistance compared with many conventional flexible adhesive systems.

This is valuable for electrical equipment, industrial components and assemblies exposed to changing temperatures.

Chemical Resistance

CEMEDINE’s historical technical data shows good resistance to a range of industrial chemicals, oils, fuels, water, dilute acids and alkaline environments.

This helps maintain bond durability in demanding industrial applications.

Excellent Electrical Insulation

The cured epoxy provides high electrical resistivity, making EP007 suitable for selected electrical and electronic component bonding and sealing applications.

Applications

Electrical and Electronic Components

CEMEDINE EP007 Flexible Epoxy 1kg is suitable for bonding and sealing electrical and electronic parts requiring strong adhesion, flexibility and insulation.

Precision Equipment

The approximately 60-minute working time allows accurate positioning of components before significant curing develops.

Metal Bonding

EP007 provides strong adhesion to steel, aluminum, stainless steel and copper.

CEMEDINE historical test data shows particularly strong performance on stainless steel and aluminum.

Plastic and Composite Bonding

The adhesive can be used for selected rigid plastics, FRP and composite components.

Actual compatibility should always be confirmed before production use.

Construction Composite Materials

EP007 can also be used for bonding selected composite members in construction and industrial fabrication.

Industrial Assembly

The combination of strong shear adhesion and high peel resistance makes EP007 useful for machinery, equipment, automotive-related parts and general industrial assembly.

Mixing and Curing Information

Base Resin:
CEMEDINE EP007 AP-180 – 500g

Hardener:
CEMEDINE EP007 AP-181 – 500g

Total Capacity:
1kg Set

Mixing Ratio:
Base Resin : Hardener = 1 : 1 by weight

Pot Life:
Approx. 60 Minutes at 23°C

Time to Practical Strength:
Approx. 12 Hours at 23°C

Standard Cure:
Approx. 23°C × 7 Days

Both components must be thoroughly mixed before application. AP-180 base resin or AP-181 hardener should not be used individually.

Technical Information

Brand: CEMEDINE

Model: EP007

Base Resin Code: AP-180

Hardener Code: AP-181

Product Type: Flexible Two-Part Epoxy Adhesive

Total Capacity: 1kg

Base Resin Capacity: 500g

Hardener Capacity: 500g

Base Resin Main Component: Epoxy Resin

Hardener Main Component: Modified Polyamide

Base Resin Color: Light Yellow Transparent

Hardener Color: Light Brown Transparent

Base Resin Viscosity: Approx. 12 Pa·s at 23°C

Hardener Viscosity: Approx. 34 Pa·s at 23°C

Base Resin Density: Approx. 1.17 g/cm³

Hardener Density: Approx. 0.95 g/cm³

Mixing Ratio: 1:1

Pot Life: Approx. 60 Minutes

Practical Strength: Approx. 12 Hours

Tensile Shear Strength: Approx. 22.0 MPa

T-Peel Strength: Approx. 2.20 N/mm

Hardness: Shore D 78

Glass Transition Temperature: Approx. 56°C

Water Absorption: Approx. 0.7%

Volume Resistivity: Approx. 4.0 × 10¹⁵ Ω·cm

Key Features:
Flexible / High Peel Strength / Heat Resistant / Chemical Resistant / Electrical Insulation

Product Status:
Legacy / Discontinued Model – Replaced by CEMEDINE EP007A

Why Choose CEMEDINE EP007 Flexible Epoxy 1kg

CEMEDINE EP007 Flexible Epoxy 1kg provides a useful balance of high bonding strength, flexibility and excellent peel resistance.

Unlike more rigid standard epoxy systems, EP007 is better suited to assemblies exposed to vibration, movement and repeated temperature changes.

Its strong adhesion to metals and selected plastics, together with good heat resistance, chemical resistance and electrical insulation, makes it suitable for electronics, precision equipment and demanding industrial assembly.

For customers requiring the original EP007 formulation, this AP-180 and AP-181 1kg set is suitable for existing production specifications and legacy applications where EP007 is specifically required.