Table of Contents

CEMEDINE EP138 Epoxy Adhesive for One-Part Heat-Cure Bonding

CEMEDINE EP138 Epoxy Adhesive is a one-component, heat-curing industrial adhesive developed for strong and durable bonding of metals, ceramics, plastics, and compatible mixed-material assemblies. Its high-viscosity, thixotropic formulation provides excellent non-sag performance, allowing the adhesive to remain in position when applied to vertical surfaces, component edges, and joints where low-viscosity materials may flow away from the required area.

Because CEMEDINE EP138 Epoxy Adhesive is supplied as a ready-to-use one-part material, operators do not need to measure or mix separate resin and hardener components. This eliminates mixing-ratio errors and helps reduce variations in cured performance. The product is particularly suitable for automated dispensing, repeatable production lines, precision equipment assembly, and electrical or electronic component manufacturing.

Key Benefits of CEMEDINE EP138 Epoxy Adhesive

CEMEDINE EP138 Epoxy Adhesive is a light yellowish-brown epoxy with a typical viscosity of approximately 240 Pa·s at 23°C and a density of about 1.4 g/cm³. Its high-viscosity consistency enables controlled bead application and helps the material bridge normal production tolerances without excessive dripping or spreading.

The adhesive can be cured using different validated heating schedules. CEMEDINE lists standard curing conditions of approximately 30 minutes at 120°C or 20 minutes at 150°C. The curing period should be measured after the complete adhesive joint reaches the specified temperature. Actual oven settings and process times may therefore need adjustment according to component mass, substrate conductivity, adhesive volume, fixture design, and oven loading.

After curing under the manufacturer’s test conditions, the product provides a typical tensile-shear strength of approximately 25.6 MPa and T-peel strength of about 3.06 N/mm. Its cured hardness is approximately Shore D 88, creating a rigid and mechanically stable bond for structural and component-retention applications. These values are representative laboratory data and should be verified with the actual substrates and production process.

Electrical and Thermal Properties of CEMEDINE EP138 Epoxy Adhesive

CEMEDINE EP138 Epoxy Adhesive provides excellent electrical-insulation performance for electrical and electronic assemblies. Published properties include a typical volume resistivity of approximately 3.0 × 10¹⁵ Ω·cm and dielectric-breakdown strength above 16 kV/mm. Its dielectric constant is approximately 4.7 at 100 Hz, with a dielectric-loss tangent of around 0.01 under the stated test conditions.

The cured material has a typical glass-transition temperature of approximately 122°C and a linear-expansion coefficient of about 5.7 × 10⁻⁵. Its published water-absorption ratio is approximately 0.1%. These characteristics support durable use in assemblies exposed to heat, humidity, temperature changes, and long-term electrical service.

Applications for CEMEDINE EP138 Epoxy Adhesive

CEMEDINE EP138 Epoxy Adhesive is suitable for machinery, electrical equipment, electronic components, sensors, coils, terminals, ceramic parts, metal housings, plastic structures, and precision industrial assemblies. CEMEDINE specifically presents bonding a choke coil to its base as a representative application.

The adhesive can be considered for metal-to-metal, ceramic-to-metal, plastic-to-metal, and other compatible rigid-material combinations. Its non-sag performance is useful for fixing components on vertical circuit assemblies, retaining parts before heat curing, and applying controlled beads around electrical or mechanical components.

Actual adhesion depends on the exact substrate grade, surface coating, joint geometry, adhesive thickness, curing profile, service temperature, and environmental exposure. Representative tests should be completed before volume production, especially with heat-sensitive plastics or coated materials.

How to Apply CEMEDINE EP138 Epoxy Adhesive

Before applying CEMEDINE EP138 Epoxy Adhesive, ensure that both bonding surfaces are clean, dry, and free from oil, grease, dust, oxide, moisture, release agents, and loose contamination. Dispense a controlled quantity onto one or both surfaces and assemble the parts before heating.

Secure the components to prevent movement, then cure the joint using a validated oven or heating process. Make sure the selected curing temperature does not deform plastics or damage nearby electronic components. Allow the assembly to cool before mechanical testing, loading, or subsequent processing.

Storage of CEMEDINE EP138 Epoxy Adhesive

Store unopened CEMEDINE EP138 Epoxy Adhesive between approximately 0°C and 10°C. CEMEDINE lists standard package sizes of 1 kg and 3 kg, although regional availability should be confirmed before ordering.

For manufacturers requiring a one-component epoxy with non-sag application, strong structural adhesion, electrical insulation, and dependable heat-cured performance, CEMEDINE EP138 Epoxy Adhesive provides an efficient solution for machinery, electrical equipment, and electronic component assembly. Explore our heat-curing epoxy adhesives for electronic components, coils, sensors, metals, ceramics, plastics, and precision industrial assembly.

heat-curing epoxy adhesives