Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM
Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM

CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive is a solvent-free bonding system for industrial assembly, repair, and sealing. It combines epoxy resin with a polythiol hardener at a 1:1 weight ratio. After mixing, the material cures at room temperature and bonds metals, plastics, composites, and electrical components. Its 30-minute working time supports accurate positioning, while handling strength can develop in about one hour.
For manufacturers and maintenance teams, CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive balances processing time with production speed. The reactive formula produces no gas during curing and forms bond lines with limited shrinkage. Once cured, it offers strong adhesion, durability, electrical insulation, and resistance to heat and chemicals. These features suit professional applications requiring consistent, long-lasting performance. Its medium-viscosity profile also supports controlled bead placement on horizontal and vertical joints, helping operators maintain coverage, reduce waste, and improve repeatability during manual or automated dispensing processes.
CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive combines controlled application with strong mechanical performance. The resin is pink and semi-transparent, while the hardener is light yellow and semi-transparent. Published data lists a resin viscosity of 70 Pa·s and a hardener viscosity of 160 Pa·s at 23°C. This consistency helps the mixture remain in place while spreading across prepared surfaces.
The product uses a 1:1 resin-to-hardener ratio, simplifying manual weighing and dual-component dispensing. Its published aluminum-to-aluminum shear strength is 17.5 N/mm² under specified test conditions. CEMEDINE also lists a Shore D hardness of 82 and a glass-transition temperature near 43°C. Results vary with substrate, preparation, bond thickness, curing temperature, and service conditions.
CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive is recommended for bonding and sealing electrical equipment and electronic components, joining construction composite members, and assembling precision equipment, craft products, and engineered parts. It may also suit metal brackets, housings, fixtures, panels, connectors, decorative components, and mixed-material assemblies requiring a strong epoxy bond.
The wider CEMEDINE two-part epoxy range bonds many metals and plastics. Users should still verify adhesion on actual production materials. Plastic formulation, coatings, release agents, oxidation, moisture, and contamination can affect performance. Testing is important when the finished assembly will experience vibration, heat, chemicals, electrical service, or sustained mechanical loading.
Before applying CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive, remove oil, grease, dust, rust, moisture, and loose material from both surfaces. Dispense equal weights of resin and hardener onto a clean surface. Mix until color and consistency are uniform, then apply the material within the working period.
Join and align the components, then secure them with clamps, tape, or fixtures. Keep the assembly stable until handling strength develops. Avoid loading, testing, packaging, or shipping before adequate curing. For repeat production, standardize the mixing ratio, adhesive quantity, bond-line thickness, fixture pressure, temperature, and curing time.
Store CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive in its original closed packaging under the current label and safety instructions. Keep resin and hardener tools separate to prevent contamination. Work in a ventilated area, wear suitable protection, and avoid skin and eye contact.
For buyers seeking a fast-curing industrial epoxy with simple 1:1 mixing, CEMEDINE EP330 Fast-Curing Two-Part Epoxy Adhesive offers convenient processing, strong adhesion, electrical insulation, and broad application potential. It is a reliable option for electronic assembly, construction composites, precision equipment, rigid component bonding, and professional repair.