DOWSIL CN-8760G Thermally Conductive Encapsulant is a two-component silicone potting material developed for the thermal management and environmental protection of printed circuit boards, power electronics, and electrical assemblies. Its medium-viscosity, flowable formulation fills spaces around components and cures into a firm but flexible elastomer. The product combines heat dissipation, electrical insulation, mechanical protection, and stress relief, making it suitable for demanding electronic manufacturing applications.

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DOWSIL CN-8760G Thermally Conductive Encapsulant for Electronic Protection

DOWSIL CN-8760G Thermally Conductive Encapsulant is supplied as a two-part system with a convenient 1:1 mixing ratio. Equal proportions of Parts A and B can be mixed using manual or automated equipment, simplifying production control and reducing the risk of inaccurate formulation.

After mixing, the dark-gray material flows around electronic components, wires, solder joints, and irregular internal structures. This flowability helps minimize unfilled spaces while providing uniform encapsulation across complex assemblies. The material can cure at room temperature or be heat-accelerated when shorter production cycles are required.

The cured silicone elastomer protects delicate components without creating the excessive rigidity associated with some conventional potting compounds. It can absorb vibration, mechanical shock, and dimensional movement caused by differences in thermal expansion between circuit boards, metals, ceramics, and plastic housings.

Key Benefits of DOWSIL CN-8760G Thermally Conductive Encapsulant

DOWSIL CN-8760G Thermally Conductive Encapsulant provides moderate thermal conductivity, helping transfer heat away from operating components and distribute it through the encapsulated assembly. Its typical thermal conductivity is approximately 0.66–0.67 W/m·K, making it suitable for applications that require both protection and practical heat dissipation.

Two-component silicone encapsulant with a convenient 1:1 ratio
Room-temperature curing or heat-accelerated processing
Moderate thermal conductivity for improved heat dissipation
Medium viscosity for effective flow around complex components
Electrical insulation and strong dielectric performance
Flexible stress relief against vibration and thermal movement
UL 94 V-0 recognized flame-retardant performance

The mixed product has a typical viscosity of approximately 2,850–3,200 mPa·s, supporting fast filling without being excessively thin. Once cured, it forms a firm elastomer with a typical Shore A hardness of approximately 45–52. This balance helps maintain component support while still providing useful flexibility.

DOWSIL CN-8760G Thermally Conductive Encapsulant Applications

DOWSIL CN-8760G Thermally Conductive Encapsulant is designed for potting and encapsulating printed circuit board systems, power modules, LED drivers, adapters, inverters, transformers, ballasts, sensors, parking-control electronics, and electrical control units.

It can also be considered for automotive electronics, industrial automation equipment, power supplies, charging systems, household appliance controls, communication devices, and renewable-energy electronics. The encapsulated layer helps protect sensitive parts against dust, moisture, environmental contamination, vibration, and accidental mechanical damage.

Its electrical insulation properties make the product suitable for assemblies containing closely positioned conductive parts. The cured material provides a typical dielectric strength of approximately 838 volts per mil, helping reduce the risk of electrical leakage when applied and cured correctly.

How to Use DOWSIL CN-8760G Thermally Conductive Encapsulant

Before application, ensure that all components and surfaces are clean, dry, and free from oil, moisture, dust, flux residue, and loose contamination. Measure equal quantities of Parts A and B and mix them thoroughly until the material has a uniform appearance.

For the best filling quality, minimize air entrapment during mixing and dispensing. Vacuum degassing may be considered for applications where trapped bubbles could affect electrical insulation, appearance, or thermal performance. Pour or dispense the mixed material slowly into the assembly and allow it to flow around all required components.

The working time is approximately 120 minutes at 25°C under typical conditions. Room-temperature curing can be completed in approximately 24 hours, while heat can significantly shorten the curing process. Actual results depend on material quantity, assembly design, curing temperature, and production conditions.

Storage and Production Testing

Store both components in their original sealed containers according to the recommended storage conditions. Prevent contamination between Parts A and B and protect the material from excessive heat, moisture, and direct sunlight.

Before mass production, test adhesion, curing, thermal performance, flame resistance, electrical insulation, and compatibility using actual components. DOWSIL CN-8760G Thermally Conductive Encapsulant is a practical solution for manufacturers seeking reliable potting, heat dissipation, electrical protection, and long-term mechanical stability in demanding electronic assemblies.

Explore our thermally conductive encapsulants for more electronic potting and heat-management solutions.

View the official DOWSIL CN-8760G product information from Dow.

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