KONISHI SL210B Elastic Adhesive is a black, one-component, solvent-free bonding and sealing material developed for electrical and electronic components. Its silyl-terminated polymer technology delivers ultra-fast skin formation while curing into a flexible elastomer that helps absorb shock, vibration, movement, and differences in thermal expansion. The non-sag paste supports controlled beads, gap filling, component fixing, and protective sealing on vertical or irregular assemblies.

KONISHI SL210B Elastic Adhesive for electronic component bonding and sealing

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KONISHI SL210B Elastic Adhesive Benefits

KONISHI SL210B Elastic Adhesive offers a very short skin-over time of approximately two to five minutes at 23°C and 50% relative humidity. This rapid surface curing supports shorter production cycles and earlier handling of assembled parts. The ready-to-use format eliminates weighing and mixing, helping reduce operator error and preparation time in manual or automated dispensing.

The cured material remains elastic rather than becoming brittle. This flexibility helps distribute mechanical stress and protect delicate components when the assembly is exposed to impact, vibration, or repeated temperature changes. The black appearance provides strong visual contrast for dispensing inspection and can blend naturally with dark electronic housings and modules.

KONISHI SL210B Elastic Adhesive Applications

The product is designed for bonding, fixing, filling, and sealing electrical and electronic components. Typical uses include speaker assemblies, digital-camera mechanisms, sensors, connectors, small motors, printed circuit board components, appliance modules, and housings. It can bond compatible stainless steel, ABS, polycarbonate, and other industrial substrates after proper surface preparation and application testing.

Its paste consistency makes it useful around components where run-off must be controlled. The elastic bond can accommodate minor movement between different materials, making the product suitable for metal-to-plastic and plastic-to-plastic assemblies. Because plastic formulations and surface treatments vary, verify adhesion on actual production parts before approval.

Typical KONISHI SL210B Elastic Adhesive Properties

Published guide values include viscosity of 50 to 100 Pa·s at 23°C, specific gravity of 1.20 to 1.30, Shore A hardness near 50, maximum tensile stress of approximately 4.5 N/mm², and elongation at break of about 275%. Typical tensile-shear strength is listed at 3.75 N/mm² for stainless steel, 2.50 N/mm² for ABS, and 2.59 N/mm² for polycarbonate under the stated test methods.

Electrical characteristics include volume resistivity of approximately 1.7 × 10¹² Ω·cm, thermal conductivity of 0.24 W/m·K, dielectric constant of 4.91 at 1 MHz, and dissipation factor of 0.0464. These are representative laboratory values, and actual performance depends on surface condition, temperature, humidity, cure time, and joint design.

How to Apply KONISHI SL210B Elastic Adhesive

Clean all bonding surfaces and remove oil, moisture, dust, oxidation, and mold-release residue. Apply a continuous bead or controlled dot to one substrate, assemble the parts promptly, and fixture them until sufficient handling strength develops. Ensure the material has access to atmospheric moisture during curing, especially in deep joints or enclosed assemblies.

Optimize dispensing pressure, nozzle size, adhesive quantity, bond-line thickness, and fixture time through production trials. Close the package securely after use and follow the current Safety Data Sheet for ventilation, personal protection, storage, and disposal requirements.

Why Buy KONISHI SL210B Elastic Adhesive?

KONISHI SL210B Elastic Adhesive combines ultra-fast curing, flexible performance, non-sag application, electrical insulation, and adhesion to common engineering plastics and metals. The formulation is free from tin compounds and is available in 120 ml tubes and 333 ml cartridges, supporting both small-batch work and regular production dispensing.

Review the official KONISHI SL and FB Series catalog before qualification. Explore our electronic component adhesives for additional flexible bonding, sealing, fixing, and assembly solutions.

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