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CEMEDINE EP138 AP-026 1kg One-Part Heat-Curing Non-Sag Epoxy Adhesive for Electronics and Precision Equipment
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CEMEDINE EP138 AP-026 1kg is a one-part high-viscosity heat-curing epoxy adhesive designed for industrial and electronic assembly. Its non-sag formulation provides strong bonding, excellent electrical insulation, heat and chemical resistance, and reliable application on vertical surfaces without requiring resin and hardener mixing.
CEMEDINE EP138 Heat Cure Adhesive 1kg is a one-component, high-viscosity epoxy adhesive developed for industrial bonding applications requiring excellent strength, non-sag application, electrical insulation and reliable heat-curing performance. The AP-026 1kg package is suitable for electrical and electronic components, precision equipment, machinery and professional manufacturing applications.
CEMEDINE EP138 is a one-part heat-curing epoxy resin adhesive designed to eliminate the weighing and mixing process required with conventional two-component epoxy systems.
Because the product is supplied as a ready-to-use single component, manufacturers can reduce mixing errors and variations in adhesive performance. This makes EP138 particularly suitable for controlled industrial production and repeatable assembly processes.
The formulation has a high viscosity of approximately 240 Pa·s at 23°C and provides excellent non-sag performance. This helps the adhesive remain in position on vertical surfaces and around components before heat curing.
CEMEDINE EP138 Heat Cure Adhesive 1kg is supplied as a light yellowish-brown material and should be stored under refrigerated conditions at approximately 0°C to 10°C.
Key Features and Advantages
One-Part Heat-Curing System
EP138 requires no separate hardener and no resin-to-hardener mixing process.
This helps simplify production, reduce preparation errors and provide more consistent bonding performance in manufacturing environments.
High-Viscosity Non-Sag Performance
The high-viscosity formulation is designed to resist flowing or dripping after application.
CEMEDINE EP138 Heat Cure Adhesive 1kg is therefore suitable for vertical surfaces, component fixing and applications where the adhesive bead needs to remain accurately positioned before curing.
Strong Bonding Performance
The product provides high tensile shear strength after proper heat curing. Its typical tensile shear strength is approximately 25.6 MPa under CEMEDINE’s specified test conditions.
This strong cured performance makes it suitable for demanding structural and industrial assembly applications.
Heat and Chemical Resistance
The cured epoxy provides good heat resistance, chemical resistance and long-term durability.
It is suitable for equipment and components exposed to changing temperatures, oils, chemicals and demanding industrial environments.
Electrical Insulation
EP138 offers excellent electrical insulation characteristics, making it particularly useful for electrical and electronic component assembly.
Its typical volume resistivity is approximately 3.0 × 10¹⁵ Ω·cm.
Low Curing Shrinkage
The epoxy system produces relatively low shrinkage during curing, helping reduce dimensional stress and maintain stable positioning of bonded components.
Applications
Electrical and Electronic Components
CEMEDINE EP138 Heat Cure Adhesive 1kg is suitable for bonding and sealing selected electrical and electronic components where high strength and insulation performance are required.
CEMEDINE specifically proposes applications such as bonding choke coils to bases.
Precision Equipment
EP138 can be used in precision machinery and equipment assemblies where controlled adhesive placement and durable bonding are important.
Metal and Ceramic Bonding
The adhesive provides strong bonding to metals and ceramics and is useful for mechanical components and industrial assemblies.
Plastic Component Bonding
EP138 can also bond selected plastic materials. Compatibility and curing temperature resistance should be confirmed with the actual plastic substrate before production use.
Automotive and Industrial Equipment
The adhesive is also used in applications associated with vehicles, machinery and other industrial equipment requiring durable epoxy bonding.
Technical Information
Brand: CEMEDINE
Model: EP138
Product Code: AP-026
JAN Code: 4901761149334
Product Type: One-Part Heat-Curing Epoxy Adhesive
Characteristic: High-Viscosity Non-Sag Type
Color: Light Yellowish Brown
Capacity: 1kg
Main Component: Epoxy Resin
Viscosity: Approx. 240 Pa·s at 23°C
Density: Approx. 1.40 g/cm³
Standard Cure: 120°C × 30 Minutes
Alternative Cure: 150°C × 20 Minutes
Tensile Shear Strength: Approx. 25.6 MPa
T-Peel Strength: Approx. 3.06 N/mm
Hardness: Shore D 88
Glass Transition Temperature: Approx. 122°C
Water Absorption: Approx. 0.10%
Linear Expansion Coefficient: Approx. 5.7 × 10⁻⁵/K
Volume Resistivity: Approx. 3.0 × 10¹⁵ Ω·cm
Storage Temperature: 0°C to 10°C
Why Choose CEMEDINE EP138
CEMEDINE EP138 provides a practical combination of high bonding strength, non-sag application, electrical insulation and reliable heat-curing performance.
The one-component formulation eliminates mixing errors, while the high viscosity helps maintain accurate adhesive placement before curing.
For electronics, precision equipment, machinery and industrial component assembly, EP138 is a professional epoxy solution designed for stable and repeatable manufacturing processes.
