CEMEDINE EP001K RE-478 2kg Elastic Epoxy Adhesive Set for Engineering Plastics, Electronics and Dissimilar Materials

CEMEDINE EP001K Elastic Epoxy 2kg is a two-component room-temperature curing elastic adhesive developed for engineering plastics, electronic components, precision equipment and demanding dissimilar-material bonding applications. The RE-478 set contains 1kg base resin and 1kg hardener and combines the adhesion characteristics of epoxy technology with the flexibility of a modified silicone polymer system.

Product Overview

CEMEDINE EP001K is designed to overcome one of the traditional limitations of conventional rigid epoxy adhesives. Instead of producing a hard and brittle bond layer, EP001K cures to form a flexible and tough adhesive layer that can better accommodate movement, vibration and differences in thermal expansion between bonded materials.

The two components are supplied separately and mixed at a 1:1 ratio before application. The base resin has a milky-white appearance, while the hardener is light yellow.

CEMEDINE EP001K Elastic Epoxy 2kg is particularly suitable for manufacturers working with engineering plastics such as PBT and PPS, as well as metal, glass and mixed-material assemblies.

Key Features and Advantages

Flexible and Tough Cured Bond

The cured adhesive has rubber-like elasticity while maintaining the strong adhesion characteristics associated with epoxy technology.

This helps reduce stress concentration at the bonding interface and improves durability where bonded components experience movement or impact.

Excellent Dissimilar Material Bonding

EP001K is designed for joining materials with significantly different coefficients of thermal expansion.

Typical applications include plastic-to-metal, glass-to-metal and engineering-plastic assemblies where temperature changes may generate internal stress.

Engineering Plastic Compatibility

CEMEDINE EP001K Elastic Epoxy 2kg offers excellent adhesion to a wide range of engineering plastics.

CEMEDINE specifically highlights PBT and PPS, materials that can be difficult to bond reliably using conventional adhesive systems.

Resistance to Vibration and Thermal Cycling

The flexible cured layer helps absorb vibration and stress caused by repeated heating and cooling cycles.

This makes EP001K useful for automotive components, electronics, precision equipment and industrial assemblies that operate under changing environmental conditions.

High Peel Performance

The elastic adhesive structure provides strong peel resistance compared with conventional rigid epoxy systems.

This is beneficial when bonded parts are exposed to peeling, bending, shock or dynamic loads.

Siloxane-Free Technology

EP001K does not contain low-molecular-weight siloxane compounds that can contribute to electrical contact problems.

This makes it particularly attractive for electronic components, sensors, cameras and other precision electrical assemblies.

Applications

Electronic Components

CEMEDINE EP001K Elastic Epoxy 2kg is suitable for bonding and potting electrical and electronic components where vibration resistance and flexible bonding are required.

Engineering Plastics

The adhesive is suitable for PBT, PPS and many other engineering plastics used in automotive, electronics and precision equipment manufacturing.

Precision and Optical Equipment

EP001K can be used for bonding glass and other materials in precision instruments, optical equipment and camera-related components.

Metal and Plastic Assemblies

The adhesive is useful for joining aluminum, stainless steel and other metals to plastic components where thermal expansion differences may create stress.

Industrial and Construction Components

EP001K is also suitable for industrial parts, construction-related components and assemblies requiring high peel resistance and durable elastic adhesion.

Mixing and Curing Information

Product:
CEMEDINE EP001K RE-478

Base Resin:
1kg

Hardener:
1kg

Total Capacity:
2kg Set

Mixing Ratio:
Base Resin : Hardener = 1 : 1

Pot Life:
Approx. 10 Minutes at 23°C

Set Time:
Approx. 40 Minutes at 23°C

Time to Practical Strength:
Approx. 24 Hours at 23°C

Standard Cure:
23°C × 7 Days

Alternative Standard Cure:
23°C × 3 Days + 50°C × 3 Days

The two components should be mixed thoroughly before application to achieve consistent curing and performance.

Technical Information

Brand: CEMEDINE

Model: EP001K

Product Code: RE-478

JAN Code: 4901761510998

Product Type: Two-Part Elastic Epoxy Adhesive

Total Capacity: 2kg

Package Configuration:
Base Resin 1kg + Hardener 1kg

Base Resin Main Component:
Epoxy Resin

Hardener Main Component:
Modified Silicone Polymer

Base Resin Color:
Milky White

Hardener Color:
Light Yellow

Base Resin Viscosity:
Approx. 14 Pa·s at 23°C

Hardener Viscosity:
Approx. 18 Pa·s at 23°C

Base Resin Density:
Approx. 1.15 g/cm³

Hardener Density:
Approx. 1.00 g/cm³

Mixing Ratio:
1:1

Pot Life:
Approx. 10 Minutes at 23°C

Set Time:
Approx. 40 Minutes at 23°C

Practical Strength:
Approx. 24 Hours

Hardness:
Shore A 72

Glass Transition Temperature:
Approx. -65°C

Elastic Modulus:
Approx. 3.2 MPa

Breaking Strength:
Approx. 6.7 MPa

Elongation at Break:
Approx. 200%

Water Absorption:
Approx. 1.8%

Why Choose CEMEDINE EP001K Elastic Epoxy 2kg

CEMEDINE EP001K Elastic Epoxy 2kg provides a combination of strong adhesion and flexible cured performance that conventional rigid epoxy systems cannot easily achieve.

Its ability to bond engineering plastics, metals, glass and dissimilar materials makes it especially suitable for modern assemblies where components experience vibration, impact and thermal expansion.

For electronics, automotive components, precision equipment and industrial manufacturing, EP001K offers a professional solution for applications requiring both adhesion strength and long-term flexibility.

Related Links

FUJI Product Page:
https://www.hk-fuji.com/product/cemedine-ep001k-elastic-epoxy-2kg/

Official CEMEDINE Product Page:
https://www.cemedine.co.jp/technology/products/ep001k.html