ANPIN 5202 Thermal Grease High and Low Temperature Resistant Silicone Compound for CPU, LED and Heat Sink

ANPIN 5202 Thermal Grease is a silicone-based thermal interface compound designed to improve heat transfer between heat-generating electronic components and heat sinks. It combines good thermal conductivity, electrical insulation, low thermal resistance and resistance to high and low temperatures, making it suitable for electronics, LED lighting, processors, power modules and industrial heat-management applications.

Product Overview

ANPIN 5202 is supplied as a paste-type thermal grease for use between electronic components and cooling surfaces.

When two solid surfaces such as a processor and aluminum heat sink are placed together, microscopic surface irregularities can trap air between them. Because air is a poor conductor of heat, these gaps can reduce overall heat-transfer efficiency.

ANPIN 5202 Thermal Grease fills these microscopic gaps and improves contact between the component and heat sink, helping heat move more efficiently into the cooling structure.

Unlike a thermal adhesive, thermal grease does not normally cure into a rigid bond. This makes components easier to remove, service or replace when required.

Key Features and Advantages

Efficient Heat Transfer

The thermal grease helps replace insulating air gaps between electronic components and heat sinks.

This improves thermal contact and supports more stable operating temperatures in electronic assemblies.

Low Thermal Resistance

ANPIN thermal grease products are designed to provide low interface thermal resistance.

A thin, uniform application helps improve contact between the heat source and cooling surface without creating an unnecessarily thick interface layer.

Excellent Electrical Insulation

ANPIN’s thermal grease family combines thermal conductivity with electrical insulation.

This is particularly useful for electronic applications where heat must be transferred efficiently while maintaining dielectric separation around electrical components.

High and Low Temperature Resistance

ANPIN 5202 Thermal Grease is suitable for applications requiring stable thermal-interface performance under changing temperatures.

ANPIN describes its thermal grease family as having excellent resistance to both high and low temperatures, supporting use in demanding electronic and industrial environments.

Paste-Type Application

The material is supplied as a one-component paste and requires no separate hardener or mixing procedure.

This simplifies manual spreading and dispensing during assembly, maintenance and production.

Non-Curing Thermal Interface

As a thermal grease, the product remains a paste rather than forming a rigid cured adhesive layer.

This allows serviced components such as processors, modules and heat sinks to be separated more easily when repair or replacement is required.

Applications of ANPIN 5202 Thermal Grease

CPU and Processor Cooling

ANPIN 5202 Thermal Grease can be applied between processors and heat sinks to improve thermal transfer and help reduce hot spots.

LED Lighting

ANPIN officially identifies thermally conductive silicone grease as suitable for LED lighting equipment.

The material can be used between LED modules, boards and metal heat-dissipation structures.

Power Modules

The grease is suitable for thermal interfaces involving power electronics, control modules and other high-heat components.

Heat Sinks

It can be used with aluminum and other compatible heat sinks to fill microscopic surface gaps and improve contact efficiency.

Graphics Cards and Computer Equipment

ANPIN thermal grease products are used in consumer-electronics applications including computers, graphics cards and other heat-generating devices.

UPS and Power Electronics

Thermal grease can also support heat management in UPS equipment, power supplies and industrial electronic assemblies.

Application Method

Clean the contact surfaces and remove dust, oil and contamination.

Apply a thin and uniform layer of thermal grease to the heat-generating component or heat sink.

Avoid applying excessive material, because thermal grease is intended to fill microscopic gaps rather than create a thick thermal barrier.

Assemble the components using the required mechanical pressure or fastening system.

Technical Information

Brand: ANPIN

Model: 5202

Product Type: Thermally Conductive Silicone Grease

Form: Paste

Components: One-Part

Primary Function: Thermal Interface / Heat Transfer

Curing: Non-Curing

Electrical Property: Electrically Insulating

Key Properties:
Thermally Conductive / Low Thermal Resistance / High and Low Temperature Resistant / Electrically Insulating

Typical Applications:
CPU / LED / Heat Sink / Power Module / Graphics Card / UPS / Electronic Equipment

Important Technical Note

ANPIN’s current official thermal grease catalogue lists models 5013, 5204, 5254, 5302, 5402 and 5502.

The manufacturer states that the thermal conductivity of this current product family ranges from approximately 1.2 to 4.1 W/m·K depending on the individual grade.

Because 5202 is not currently shown in ANPIN’s public model table, the exact thermal conductivity, density, operating temperature range and electrical values for ANPIN 5202 should be taken from the TDS or label supplied with the actual product batch rather than copied from another ANPIN grade.

Why Choose ANPIN 5202 Thermal Grease

ANPIN 5202 Thermal Grease provides a practical thermal-interface solution for electronics that require heat transfer, low thermal resistance and electrical insulation.

Its paste-type, non-curing format also makes it suitable for applications where components may need future maintenance or replacement.

For processors, LED assemblies, power modules, heat sinks and industrial electronics, ANPIN 5202 offers an easy-to-apply thermal management material designed for demanding temperature environments.

Related Links

FUJI Product Page:
https://www.hk-fuji.com/product/anpin-5202-thermal-grease/

Official ANPIN Website:
https://www.apsimaterials.com/