Kafuter K-5235 Thermal Conductive Gel is a high-performance, one-component silicone-based thermal interface material designed to transfer heat from electronic components to heat sinks, housings, cooling plates, and other heat-dissipation structures. The pink gel contains high-performance ceramic fillers and combines high thermal conductivity with low thermal resistance, electrical insulation, and excellent surface conformity. Its soft, compressible consistency helps fill uneven interfaces and microscopic gaps that can trap air and reduce heat-transfer efficiency.

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Kafuter K-5235 Thermal Conductive Gel Performance

Kafuter publishes a thermal conductivity of 5.0 ± 0.5 W/m·K under the referenced ASTM D5470 test method. This performance supports rapid heat transfer across the interface between a heat-generating device and its cooling structure. Compared with rigid thermal pads, the gel can conform more closely to irregular surfaces and variable gaps, helping increase the effective contact area while reducing localized air pockets.

The material is designed to remain soft and compressible, which can reduce mechanical stress on delicate components during assembly. It also provides electrical insulation, making it suitable for applications where heat must be transferred without creating an electrically conductive path. Official Kafuter application information identifies the product as a pink, single-component thermal gel with a UL 94 V-0 flame-retardant rating.

Kafuter K-5235 Thermal Conductive Gel Applications

Typical applications include LED chips, communication equipment, mobile-phone CPUs, memory modules, IGBTs, power modules, power semiconductors, control boards, charging equipment, and other electronic assemblies that generate concentrated heat. The gel can be dispensed between components and heat sinks, inside housings, or onto cooling plates where a soft gap-filling thermal interface is required.

Its paste-like form supports manual dispensing as well as automated production. Manufacturers can control the applied volume according to the component shape, gap size, pressure, and target bond-line thickness. This makes the product useful for complex PCB layouts, uneven component heights, curved surfaces, and assemblies where conventional die-cut pads may be difficult to position or may not provide complete contact.

7 Benefits of Kafuter K-5235 Thermal Conductive Gel

High thermal conductivity: Rated at 5.0 ± 0.5 W/m·K for efficient heat transfer.
Low thermal resistance: Helps improve heat flow between components and cooling structures.
Automatic gap filling: Conforms to uneven surfaces and fills microscopic interface voids.
Electrical insulation: Supports thermal management around powered electronic components.
Soft compressible structure: Reduces mechanical pressure on sensitive devices.
Flame-retardant performance: Official application data lists a UL 94 V-0 rating.
Production flexibility: Suitable for manual dispensing and automated application systems.

Application and Process-Control Guidance

Ensure the component and heat-dissipation surfaces are clean, dry, and free from oil, dust, moisture, old thermal material, and loose contamination. Dispense the required quantity onto the target area and assemble the parts using controlled pressure. The gel should spread across the interface without excessive overflow, contamination of connectors, or interference with nearby components.

Process validation should establish dispensing volume, bond-line thickness, compression, assembly pressure, and thermal performance. Excessive material can increase mess and assembly weight, while insufficient coverage may leave air gaps. Evaluate the product on representative hardware under actual power loads, temperature cycling, vibration, humidity, and long-term operating conditions before approving mass production.

Storage, Handling, and Official Product Resources

Keep the package sealed when not in use and protect the material from dust, moisture, and foreign particles. Kafuter states a storage period of 12 months under the recommended conditions. Exact package sizes, storage temperature, dispensing equipment, and regional specifications should be confirmed from the current label, technical data sheet, and safety data sheet.

Review the official Kafuter K-5235 product page and the official Kafuter industrial application guide for current performance and application information.

Explore our thermal conductive gels for additional thermal interface materials. Browse our electronics thermal management materials for LEDs, processors, memory, IGBTs, power modules, and communication equipment. Contact our sales team for quotations, samples, packaging options, technical documents, bulk orders, and export support.