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KONISHI FB300ZW Flame Retardant Elastic Adhesive for Electronics
Brand: Konishi
Model: FB300ZW
Name: Elastic Adhesive
Product Specification: 333ml per piece
Shelf Life: 12 months
Product Features: Does not use low-molecular cyclic polysiloxane that may cause contact disorders. Due to its elasticity, it causes less deformation on the bonding material and can resist thermal shock.
Application Scope: It can be used for the bonding of various materials. Bonding of various hard plastic materials such as polycarbonate ABS resin and bonding of metal materials; Bonding of hard materials with different thermal expansion coefficients
KONISHI FB300ZW Flame Retardant Elastic Adhesive Performance
The modified silicone chemistry cures through exposure to atmospheric moisture and does not require a separate hardener. Its paste consistency supports controlled cartridge dispensing into seams, around components, and on irregular bonding areas. As curing progresses, the material forms an elastic layer that can accommodate differences in thermal expansion between dissimilar substrates. This is useful when plastic and metal parts are joined in assemblies exposed to heating, cooling, shock, or vibration.
FB300ZW is intended for applications where flame resistance is required. Product information describes the formulation as avoiding halogen-, phosphorus-, and antimony-based flame retardants. It is also described as free from low-molecular-weight cyclic polysiloxanes that may contribute to electrical contact problems. These features make it relevant to manufacturers seeking an electronic assembly adhesive with controlled composition and flexible cured performance.
Electrical, Electronic, Plastic, and Metal Applications
KONISHI FB300ZW Flame Retardant Elastic Adhesive can be used as both an adhesive and a filling material in electrical and electronic assemblies. Typical uses include securing PCB components, fixing connectors, reinforcing wires, sealing component edges, attaching plastic housings, and filling gaps requiring a flexible flame-retardant material. Its white appearance also supports visual inspection of coverage during assembly.
The product is suitable for bonding polycarbonate, ABS, other rigid plastics, and compatible metals. It can also join hard materials with different thermal expansion coefficients and reinforce components subjected to impact or vibration. It is not recommended for polyethylene, polypropylene, silicone resin, or fluoropolymer surfaces without validated pretreatment or specialist guidance.
7 Benefits of KONISHI FB300ZW Flame Retardant Elastic Adhesive
- One-component processing: Requires no measuring, mixing, or separate curing agent.
- Room-temperature cure: Supports production without mandatory heat-curing equipment.
- Flame-retardant design: Suitable for selected electrical and electronic component applications.
- Flexible cured bond: Helps reduce stress and deformation in joined materials.
- Thermal-shock resistance: Accommodates repeated heating, cooling, and material movement.
- Multi-material adhesion: Bonds compatible polycarbonate, ABS, rigid plastics, and metals.
- Electronic-friendly formulation: Avoids low-molecular cyclic polysiloxanes associated with contact concerns.
Application and Curing Guidance
Ensure all bonding surfaces are clean, dry, and free from oil, grease, dust, moisture, release agents, oxidation, and loose contamination. Cut the cartridge nozzle to the required bead size and apply a continuous layer to one surface or into the required filling area. Assemble the parts before skin formation and hold them until the adhesive develops handling strength.
Curing speed depends on temperature, humidity, bead thickness, joint depth, substrate permeability, and air access. Deep fills and enclosed joints require more time because atmospheric moisture must reach the uncured material. Users should confirm cure time, adhesion, flame performance, electrical compatibility, and long-term durability on representative production assemblies before commercial use.
Product Resources and Related Electronic Adhesives
Review the official Konishi SL and FB series catalog for electronic adhesive family information. Additional FB300ZW product details are available from the KONISHI FB300ZW product information page.
Explore our flame-retardant electronic adhesives for additional component bonding and filling products. Browse our flexible electronics assembly adhesives for PCB, housing, connector, wire, and module applications. Contact our sales team for quotations, 333 ml cartridge availability, technical documents, bulk quantities, and export support.
