Henkel LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant for Electronics
Henkel LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant for Electronics
  1. Henkel LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant for Electronics
  2. Henkel LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant for Electronics

Henkel LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant for Electronics

Thermal conductive
Electrically insulating
Low CTE
Thermal shock resistant

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LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant is a filled epoxy resin system developed for potting and protecting electrical and electronic assemblies that require efficient heat transfer, electrical insulation, and long-term mechanical stability. When combined with the appropriate compatible catalyst, the material cures into a durable encapsulant that helps protect sensitive components from vibration, moisture, thermal cycling, impact, and environmental contamination. It is widely suited to industrial electronics, power equipment, automotive modules, transformers, sensors, coils, and high-reliability electrical assemblies.

LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant
Thermally conductive and electrically insulating epoxy encapsulant for power electronics, transformers, sensors, coils, and industrial modules.

LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant Performance

Electronic components can generate substantial heat during continuous operation. If this heat is not transferred efficiently, excessive temperature may reduce component stability and shorten equipment service life. LOCTITE STYCAST 2850FT Thermally Conductive Epoxy Encapsulant helps conduct heat away from embedded components while maintaining the electrical insulation required around circuits, terminals, coils, and power devices.

The filled epoxy formulation also provides low thermal expansion and strong resistance to thermal shock. These characteristics help reduce stress when assemblies repeatedly heat and cool during operation. After curing, the rigid protective material supports components mechanically and helps prevent movement caused by vibration, transportation, or demanding industrial service conditions.

Electronic Potting and Encapsulation Applications

Typical applications include potting transformers, power supplies, ignition components, sensors, motor components, coils, relays, high-voltage modules, industrial controllers, automotive electronics, communication equipment, and LED power assemblies. The material is particularly useful when a conventional general-purpose epoxy does not provide sufficient thermal-management performance.

Its flow characteristics allow the mixed system to move around component leads and into spaces within correctly designed housings. Manufacturers can use controlled dispensing, vacuum-assisted potting, or manual filling methods depending on production volume, component geometry, and quality requirements. The actual catalyst, mixing ratio, pot life, and cure schedule must be selected according to the latest Henkel technical documentation.

7 Benefits for Electronics Manufacturers

  • Thermal conductivity: Helps transfer heat away from power components and electronic assemblies.
  • Electrical insulation: Supports dielectric protection around circuits, coils, terminals, and metal housings.
  • Thermal-shock resistance: Helps protect assemblies exposed to repeated heating and cooling cycles.
  • Low thermal expansion: Reduces dimensional stress around sensitive embedded components.
  • Mechanical reinforcement: Secures components against vibration, impact, and operational movement.
  • Environmental protection: Helps isolate electronics from moisture, dust, and industrial contamination.
  • Flexible processing: Can be combined with the appropriate catalyst to meet different production requirements.

Mixing, Dispensing, and Curing Guidance

Before mixing, bring the resin and catalyst to the recommended processing temperature. Thoroughly remix the filled resin to restore uniform filler distribution before measuring. Add the specified catalyst using the exact weight ratio listed in the current technical data sheet, then mix carefully until the material is completely uniform. Avoid introducing unnecessary air during mixing.

Vacuum degassing may be used when air-free encapsulation is required. Surfaces should be clean, dry, and free from grease, oil, dust, moisture, flux residue, and release agents. Dispense the mixture into the assembly using a controlled filling process and allow sufficient time for the material to flow around components. Cure time depends on catalyst selection, assembly mass, temperature, fill depth, and oven conditions.

Large casting volumes may generate significant exothermic heat. Manufacturers should validate maximum pour depth, staged filling, cure schedule, adhesion, thermal performance, and electrical properties with representative production assemblies before approval.

Official Resources and Related Electronic Materials

Review the official LOCTITE STYCAST 2850FT technical data sheet for the correct catalyst options, mixing ratios, cure schedules, storage requirements, and typical performance values. Additional product and application information is available through the official Henkel product search.

Explore our thermally conductive potting compounds for additional heat-dissipation materials. You can also browse our electronic epoxy encapsulants for electrical insulation, component reinforcement, and environmental protection. Contact our sales team for resin and catalyst availability, quotations, technical documentation, bulk purchasing, and export support.

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