KONISHI FB500ZW Adhesive is a white, one-component, moisture-curing elastic adhesive developed for electronic and electrical assembly. It is the white version of the FB500Z grade and forms a firm elastic bond after exposure to atmospheric moisture. The product combines UL 94 V-0 flame-retardant performance, controlled dispensing, electrical component fixation, and moisture-resistant coating capability, making it suitable for fan motors, printed circuit boards, power units, transformers, and other assemblies requiring dependable protection.

Table of Contents

Product Overview
Key Benefits
Applications
Application Guide

Table of Contents

KONISHI FB500ZW Adhesive for Electronic Assembly

KONISHI FB500ZW Adhesive is supplied as a ready-to-use white paste, eliminating the need to measure or mix separate components. Its one-part format helps simplify production, reduce preparation errors, and support repeatable manual or automated dispensing.

The material is based on a moisture-curing silicone-modified polymer system. After application, atmospheric moisture initiates curing and gradually converts the paste into a durable elastic layer. This flexible structure helps accommodate vibration, limited movement, and differences in thermal expansion between circuit boards, wires, metals, plastics, and other compatible materials.

The FB500Z series is designed for good dispensing performance. The typical viscosity range of FB500ZW is 50–150 Pa·s at 23°C, allowing the adhesive to be applied as a controlled bead around components, lead wires, and selected circuit-board areas without excessive flow. Its white appearance also supports visual inspection in light-colored electronic assemblies.

Key Benefits of KONISHI FB500ZW Adhesive

KONISHI FB500ZW Adhesive belongs to Konishi’s UL 94 V-0 flame-retardant elastic adhesive range. The formulation does not use designated RoHS ten substances and is designed without halogen-, phosphorus-, or antimony-based flame retardants. Konishi also identifies the series as free from tin compounds and low-molecular-weight cyclic siloxanes.

One-component moisture-curing elastic adhesive
White paste for visible and controlled application
UL 94 V-0 flame-retardant performance
Good dispensing characteristics for production equipment
Suitable for component fixing and moisture-resistant coating
Free from specified tin compounds and cyclic siloxanes
Designed for electrical and electronic manufacturing

The product provides a typical skin-forming time of 5–15 minutes at 23°C and 50% relative humidity. This offers useful working time for accurate placement while allowing the exposed surface to begin setting relatively quickly. Its typical density is 1.59 ± 0.05 at 23°C.

After curing, the adhesive provides a typical maximum tensile stress of 3.9 N/mm², elongation at break of 50%, and Shore A hardness of 85 under the manufacturer’s stated test conditions. These properties create a relatively firm elastic bond suitable for securing components and protecting selected electronic areas.

Applications of KONISHI FB500ZW Adhesive

KONISHI FB500ZW Adhesive is recommended for fixing lead wires in fan motors and applying moisture-resistant protective coatings to electronic circuit boards. It can also be evaluated for securing components on power-supply boards, transformers, control boards, communication equipment, household appliances, and other electrical assemblies requiring flame resistance and controlled adhesive placement.

The elastic cured layer can help reduce stress around wires and components exposed to vibration or movement. When applied around selected circuit-board areas, it can also provide an additional barrier against moisture and environmental contamination. The actual protection level depends on coating thickness, coverage, substrate condition, and assembly design.

How to Apply KONISHI FB500ZW Adhesive

Before application, ensure that all surfaces are clean, dry, and free from oil, dust, flux residue, moisture, oxidation, and release agents. Dispense a uniform bead or coating onto the required area and position the component before skin formation begins.

Curing speed depends on temperature, relative humidity, bead thickness, airflow, and joint geometry. Because moisture must penetrate the adhesive, thicker sections require additional curing time. Avoid testing, electrically loading, or packaging the assembly until sufficient curing has developed.

For production use, complete adhesion, flame-resistance, insulation, vibration, temperature-cycle, and moisture-resistance tests with actual materials. Store the product in its original sealed package and follow the latest technical data sheet and safety data sheet.

KONISHI FB500ZW Adhesive provides a practical combination of white appearance, reliable dispensing, flame-retardant performance, elastic fixation, and moisture protection for professional electronic manufacturing.

Explore our electronic component adhesives for additional PCB fixing, sealing, and protective bonding solutions.

Review the official KONISHI electronic adhesive product brochure for manufacturer specifications and application guidance.

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