Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM
Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM


This moisture-curing silicone forms a flexible, electrically insulating elastomer that helps protect electronic assemblies from vibration, shock, moisture, ozone, weathering, and severe operating environments. Its elasticity allows the cured material to accommodate movement and differences in thermal expansion without creating excessive stress on fragile components. The product is designed for continuous service from approximately -50°C to 200°C, supporting electronics exposed to both low-temperature operation and sustained industrial heat.
Typical cured properties include Shore A hardness of at least 25, elongation of at least 500%, tensile strength of at least 3.4 MPa, and tear strength of approximately 40 N/mm. These characteristics provide a useful balance of flexibility, mechanical strength, and shock absorption. Electrical performance includes dielectric breakdown strength of approximately 18 kV/mm and volume resistivity of 4 × 1015 Ω·cm, making the silicone suitable for insulating and protecting correctly designed electronic assemblies.
Typical applications include reinforcing delicate components, providing strain relief around wires and connectors, sealing electrical housings, bonding components to circuit boards, protecting terminals, and coating localized areas that require environmental resistance. It may be considered for automotive control modules, sensors, communication equipment, military electronics, industrial controllers, power supplies, lighting assemblies, appliances, and other electronic devices.
The non-slumping texture is particularly useful for vertical surfaces, component edges, overhead areas, and targeted reinforcement points. Because actual adhesion depends on substrate type, surface treatment, contamination, joint geometry, and curing conditions, manufacturers should test the product on representative metals, plastics, coatings, circuit boards, and electronic components before approving a production process.
Clean all bonding surfaces and remove grease, oil, dust, moisture, flux residue, and loose contamination before application. Dispense the required amount directly onto the assembly and join mating components within a few minutes because moisture curing begins immediately after exposure to air. Excess uncured material may be removed using a suitable non-polar solvent.
Full performance develops over approximately 72 hours, although curing speed depends on temperature, humidity, bead dimensions, and joint design. Deep or enclosed sections may require additional time because atmospheric moisture must reach the silicone. Store unopened containers in a dry location, ideally between 8°C and 21°C, and do not return dispensed material to the original package.
Review the official Henkel LOCTITE SI 5145 product page and the official LOCTITE SI 5145 technical data sheet for current specifications, regional approvals, processing recommendations, and safety documentation. These are standard DoFollow external links because no nofollow attribute is applied.
Explore our electronic silicone adhesives for related component bonding and strain-relief solutions. You can also browse our electronic potting compounds for deeper encapsulation and environmental protection. Available packaging includes 40 ml tubes and 300 ml cartridges in selected markets. Contact our sales team for quotations, stock availability, export documentation, bulk purchasing, and application support.