CEMEDINE SX720WH Flame Retardant Elastic Adhesive for Electronics

CEMEDINE SX720WH Flame Retardant Elastic Adhesive Performance

SX720WH combines elastic bonding with a high-viscosity paste structure that helps the adhesive remain in position on vertical surfaces, component edges, and irregular joints. Its typical viscosity is approximately 82 Pa·s at 23°C, which is higher than the standard SX720W grade. This controlled consistency supports precise beads, component staking, gap filling, and sealing without excessive dripping or migration after dispensing.

The material has a typical density of approximately 1.58 g/cm³ and a skin-over time of about seven minutes at 23°C. This relatively fast surface cure supports efficient assembly while still giving operators time to dispense, position, and adjust components. The one-part formulation eliminates weighing and mixing, helping reduce processing errors, unused mixed adhesive, and workstation preparation time.

Flame-Retardant Protection for Electronic Components

CEMEDINE SX720WH Flame Retardant Elastic Adhesive is certified to UL 94 V-0 under file number E178790. It is designed for applications where flame-retardant bonding and sealing are required around electrical or electronic parts. CEMEDINE states that the formulation does not use halogen-based, antimony-oxide, or phosphorus-based flame retardants, supporting manufacturers seeking a more environmentally considerate material for electronic assembly.

The adhesive is also siloxane-free and does not contain low-molecular-weight cyclic siloxanes from D3 through D10. This characteristic is particularly valuable around switches, relays, connectors, and other electrical contacts where volatile siloxanes may contribute to contact reliability concerns. The product is RoHS compliant according to the manufacturer’s published product information.

Electronic Bonding, Insulation, and Waterproof Sealing Applications

Typical applications include fixing capacitors, coils, connectors, and other components onto printed circuit boards. The adhesive can also be used to provide insulating seals around power supplies and transformers and to create waterproof seals around selected electronic components, cable entries, terminals, and housings. Its elastic cured structure helps absorb vibration, mechanical impact, and dimensional changes caused by temperature cycling.

The material can bond many compatible metals, plastics, ceramics, and other industrial substrates after suitable surface preparation. Its flexibility is especially helpful when joining dissimilar materials with different thermal-expansion rates. Actual adhesion and durability depend on substrate grade, surface condition, joint geometry, adhesive thickness, curing environment, operating temperature, and exposure to moisture or chemicals.

7 Benefits of CEMEDINE SX720WH Flame Retardant Elastic Adhesive

• UL 94 V-0 classification: Supports flame-retardant electronic bonding and sealing applications.
• High-viscosity paste: Reduces sagging and unwanted flow on vertical or irregular surfaces.
• One-component processing: Requires no measuring, mixing, or separate curing agent.
• Fast skin formation: Provides a typical skin-over time of approximately seven minutes.
• Elastic cured bond: Absorbs vibration, impact, movement, and thermal expansion differences.
• Siloxane-free formulation: Contains no low-molecular-weight D3–D10 cyclic siloxanes.
• Electrical protection: Supports component fixing, insulation, and waterproof sealing.

Mechanical, Electrical, and Thermal Properties

Published SX720WH properties include tensile-shear strength of approximately 3.1 MPa and T-peel strength of about 1.1 N/mm. After curing, the adhesive provides a Shore A hardness of approximately 78, breaking strength of about 3.6 MPa, and elongation at break of approximately 40%. Its glass-transition temperature is listed at approximately -62°C, supporting flexibility in low-temperature conditions.

Electrical properties include volume resistivity of approximately 2.0 × 10¹² Ω·cm, dielectric constant of about 6.0 at 100 Hz, and dielectric loss tangent of approximately 0.3 at 100 Hz. Published thermal conductivity is approximately 1.0 W/m·K. These values make the product useful for electrical insulation and component protection, although it should not be treated as a specialized high-performance thermal interface material.

Application and Curing Guidance

Clean all bonding surfaces and remove oil, grease, dust, moisture, release agents, oxidation, and loose contamination. Apply the required bead to one surface and assemble or position the components before skin formation. For component staking, ensure the adhesive contacts both the component and the supporting board. For waterproof sealing, apply a continuous bead without gaps or trapped air.

Cure speed depends on temperature, humidity, bead thickness, joint depth, and access to atmospheric moisture. Thick deposits and enclosed joints require additional time because moisture must penetrate the adhesive. Before mass production, evaluate adhesion, curing, flame requirements, electrical insulation, vibration resistance, thermal cycling, and waterproof performance on representative assemblies.

Official Resources and Related Electronic Adhesives

Review the official CEMEDINE SX720 product page and the official CEMEDINE Super X Series guide for current technical properties, applications, packaging, and product-family information.

Explore our flame-retardant electronic adhesives for additional component-fixing and sealing materials. Browse our electronic component sealants for circuit boards, capacitors, coils, transformers, power supplies, connectors, and housings. CEMEDINE SX720WH is available in 200 g tubes and 333 ml cartridges, subject to regional supply.