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CEMEDINE 1500 AP-035 Base Resin 500g Two-Part Epoxy Adhesive for Electronics, Metal and Precision Equipment
101原价为：101。100当前价格为：100。
CEMEDINE 1500 AP-035 500g is the epoxy base resin component of the CEMEDINE 1500 two-part industrial adhesive system. It provides strong bonding, low curing shrinkage, durability and electrical insulation when mixed 1:1 with CEMEDINE 1500 AP-032 hardener. Suitable for electronics, precision equipment, metals and industrial assembly.
CEMEDINE AP-035 Base Resin 500g is the epoxy resin component of the CEMEDINE 1500 two-part room-temperature curing adhesive system. It is designed for industrial bonding and sealing applications involving electrical components, precision equipment, metals, plastics and composite materials. For proper curing, AP-035 must be mixed with the corresponding CEMEDINE 1500 AP-032 hardener at a 1:1 mixing ratio.
CEMEDINE 1500 AP-035 is supplied as a 500g can of base resin for professional and industrial use. The product is a light yellow transparent epoxy resin and forms part of CEMEDINE’s standard two-component epoxy adhesive system.
The 1500 series is a solvent-free reactive adhesive system developed to provide strong bonding, low curing shrinkage, excellent durability and reliable electrical insulation.
CEMEDINE AP-035 Base Resin 500g is not intended to cure by itself. Before application, it must be thoroughly mixed with CEMEDINE 1500 hardener AP-032. The recommended mixing ratio is 1:1.
This separate-component packaging is particularly convenient for industrial users who purchase the base resin and hardener individually according to their production requirements.
Key Features and Advantages
Standard Industrial Epoxy System
The CEMEDINE 1500 series is a standard room-temperature curing two-part epoxy adhesive designed for a broad range of industrial bonding applications.
The cured adhesive provides strong adhesion and good durability for rigid assemblies.
Solvent-Free Reactive Formulation
The adhesive system is reactive and solvent-free. This helps minimize solvent-related shrinkage and allows the material to develop a stable cured bond through chemical reaction between the base resin and hardener.
Low Curing Shrinkage
CEMEDINE 1500 is designed to produce relatively low shrinkage during curing. This characteristic is valuable when bonding precision components where dimensional stability is important.
High Adhesion and Durability
When AP-035 is correctly combined with the matching AP-032 hardener, the cured system provides strong adhesion to a wide range of industrial materials.
The typical tensile shear strength of the complete CEMEDINE 1500 system is approximately 15.7 MPa under CEMEDINE test conditions.
Excellent Electrical Insulation
CEMEDINE AP-035 Base Resin 500g is part of an epoxy system offering excellent electrical insulation characteristics.
The cured CEMEDINE 1500 system has a typical volume resistivity of approximately 7.1 × 10¹⁵ Ω·cm, making it useful for selected electrical and electronic applications.
Applications
Electrical and Electronic Components
The CEMEDINE 1500 system is suitable for bonding and sealing electrical and electronic parts where durable adhesion and insulation are required.
Precision Equipment Assembly
The relatively long working time allows operators sufficient time for positioning and alignment of precision components before significant curing occurs.
Metal Bonding
The adhesive system can be used for bonding steel, aluminum, copper and other suitable metals.
Composite Material Bonding
CEMEDINE 1500 is also used for bonding composite members in construction and industrial fabrication.
Industrial Assembly and Repair
CEMEDINE AP-035 Base Resin 500g can be used as part of the 1500 system for machinery, equipment, craft products and general industrial assembly.
Mixing and Curing Information
AP-035 must be used together with CEMEDINE 1500 AP-032 hardener.
CEMEDINE AP-035 Base Resin 500g provides industrial users with the base component of a proven standard epoxy bonding system.
When combined with AP-032 hardener, the CEMEDINE 1500 system offers strong adhesion, low curing shrinkage, electrical insulation and reliable durability for electronics, precision equipment, metals and industrial assemblies.
The separate 500g packaging is also useful for manufacturers who manage resin and hardener inventory independently or require replacement of only one component.
