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Weekend: 10AM - 5PM
Address
304 North Cardinal
St. Dorchester Center, MA 02124
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM


The cured adhesive is designed to create a durable bond between compatible components while filling small irregularities in the joint. ET5155 can support tasks such as fixing components, reinforcing connectors, bonding housings, securing inserts, and joining selected metal, plastic, ceramic, or composite parts after application testing.
Because ET5155 is a two-component product, correct mixing is essential. A compatible dispensing gun and static mixing nozzle can combine both sides consistently and deliver a uniform bead. Components should be assembled within the working period stated in the current technical documentation and held securely until handling strength develops.
PERMABOND ET5155 Two-Part Epoxy Adhesive is suitable for evaluated applications involving electronic modules, switches, sensors, connectors, wire supports, small housings, mechanical inserts, and component reinforcement. The 50 ml package suits controlled production, engineering trials, and compact workstations.
Actual adhesion depends on substrate grade, surface energy, contamination, joint geometry, bond-line thickness, curing conditions, and service environment. For electronic applications, users should confirm electrical performance, thermal cycling, chemical exposure, flame requirements, and compatibility with coatings, solder masks, cleaning agents, and sensitive components.
For repeatable production, operators should record cartridge temperature, mixer type, bead size, assembly time, and fixture conditions. Maintaining these variables helps reduce variation between shifts and supports more predictable cure development. Automated or semi-automated dispensing may also improve placement accuracy when the adhesive is used around small components or narrow joint areas. Production approval should include documented test results for adhesion, cure, temperature exposure, vibration, and long-term service conditions.
Clean the bonding surfaces thoroughly and remove oil, grease, dust, moisture, oxidation, release agents, and loose contamination. Allow the solvent to evaporate before applying the adhesive. Install the cartridge in the correct applicator, confirm both components flow, attach a suitable mixer, discard the initial output, and dispense the required amount.
Join the parts promptly and maintain alignment throughout the fixture period. Do not load or test the assembly until adequate cure has developed. Cure speed changes with temperature, mixed volume, and joint dimensions. Before production approval, validate adhesion, impact resistance, thermal exposure, environmental durability, and electrical suitability using representative parts and the current ET5155 technical and safety data.
Review the official PERMABOND two-part epoxy selector guide and the official PERMABOND technical data sheet library for current product guidance. Request the exact regional ET5155 TDS and SDS from the supplier before setting production parameters.
Explore our two-part epoxy adhesives for additional structural bonding products. Browse our electronics assembly adhesives for component fixing, housing bonding, reinforcement, and module production. Contact our sales team for ET5155 quotations, 50 ml package availability, mixing nozzles, dispensing tools, technical documents, and export support.